METHODS FOR MANUFACTURING WIRING SUBSTRATE, THIN FILM TRANSISTOR, DISPLAY DEVICE AND TELEVISION DEVICE
PROBLEM TO BE SOLVED: To provide a manufacturing technique for a display device manufactured by improving the utilization efficiency of materials and simplifying manufacturing processes, and to provide a technique for forming a pattern such as a wiring, constituting the display device, having a desi...
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| creator | TOKUMARU AKIRA YAMAMOTO HIROKO |
| description | PROBLEM TO BE SOLVED: To provide a manufacturing technique for a display device manufactured by improving the utilization efficiency of materials and simplifying manufacturing processes, and to provide a technique for forming a pattern such as a wiring, constituting the display device, having a desired pattern with good controllability. SOLUTION: The subject method for manufacturing a wiring substrate includes the steps of: forming a first region having a material to be treated; modifying the surface of the material to be treated partly to form a second region having a boundary with respect to the first region; continuously discharging a composition containing a conductive material to a part of the first region across the boundary and the second region; solidifying the composition to form a conductive layer; and removing the conductive layer formed in the part of the first region across the boundary. COPYRIGHT: (C)2006,JPO&NCIPI |
| format | Patent |
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SOLUTION: The subject method for manufacturing a wiring substrate includes the steps of: forming a first region having a material to be treated; modifying the surface of the material to be treated partly to form a second region having a boundary with respect to the first region; continuously discharging a composition containing a conductive material to a part of the first region across the boundary and the second region; solidifying the composition to form a conductive layer; and removing the conductive layer formed in the part of the first region across the boundary. 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SOLUTION: The subject method for manufacturing a wiring substrate includes the steps of: forming a first region having a material to be treated; modifying the surface of the material to be treated partly to form a second region having a boundary with respect to the first region; continuously discharging a composition containing a conductive material to a part of the first region across the boundary and the second region; solidifying the composition to form a conductive layer; and removing the conductive layer formed in the part of the first region across the boundary. 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SOLUTION: The subject method for manufacturing a wiring substrate includes the steps of: forming a first region having a material to be treated; modifying the surface of the material to be treated partly to form a second region having a boundary with respect to the first region; continuously discharging a composition containing a conductive material to a part of the first region across the boundary and the second region; solidifying the composition to form a conductive layer; and removing the conductive layer formed in the part of the first region across the boundary. COPYRIGHT: (C)2006,JPO&NCIPI</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | METHODS FOR MANUFACTURING WIRING SUBSTRATE, THIN FILM TRANSISTOR, DISPLAY DEVICE AND TELEVISION DEVICE |
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