METHOD AND APPARATUS FOR INSPECTING FOREIGN MATTER OF SIDE WALL OF OPENING OF STENCIL MASK

PROBLEM TO BE SOLVED: To provide an inspection method for effectively inspecting foreign matter bonded to the side wall of a support part or beam of a stencil mask by a simple method, and to provide an inspection device therefor. SOLUTION: In the method for inspecting the side wall (21) of the suppo...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: SUSA TAKASHI, YONEKURA ISAO, NOHAMA SHIYOUJI, TAMURA AKIRA, ITOU KOUJIROU, NAKANO HIROYUKI, IWASE KAZUYA, KUNIYA SHINJI, MORIYA SHIGERU, KITAGAWA TETSUYA
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator SUSA TAKASHI
YONEKURA ISAO
NOHAMA SHIYOUJI
TAMURA AKIRA
ITOU KOUJIROU
NAKANO HIROYUKI
IWASE KAZUYA
KUNIYA SHINJI
MORIYA SHIGERU
KITAGAWA TETSUYA
description PROBLEM TO BE SOLVED: To provide an inspection method for effectively inspecting foreign matter bonded to the side wall of a support part or beam of a stencil mask by a simple method, and to provide an inspection device therefor. SOLUTION: In the method for inspecting the side wall (21) of the support frame (19) or beam (18) substantially vertically formed with respect to the surface of the stencil mark (10), an imaging means (41) is arranged so that the optical axis (38) thereof is inclined at a predetermined angle (θ) in the direction vertical to the surface of the stencil mask and a plurality of images are taken by changing the focal position of the imaging means with respect to the side wall of the support frame (19) or beam (18) while the whole focal image related to the sided wall of the support frame (19) or beam (18) is synthesized from a plurality of the images to be displayed by a display means (51). COPYRIGHT: (C)2006,JPO&NCIPI
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2006046944A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2006046944A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2006046944A3</originalsourceid><addsrcrecordid>eNrjZIjydQ3x8HdRcPQD4oAAxyDHkNBgBTf_IAVPv-AAV-cQTz93ENfV091PwdcxJMQ1SMHfTSHY08VVIdzRxwfE8Q9w9QMpA4mHuPo5e_oAVQZ78zCwpiXmFKfyQmluBiU31xBnD93Ugvz41OKCxOTUvNSSeK8AIwMDMwMTM0sTE0djohQBAIPFMdQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>METHOD AND APPARATUS FOR INSPECTING FOREIGN MATTER OF SIDE WALL OF OPENING OF STENCIL MASK</title><source>esp@cenet</source><creator>SUSA TAKASHI ; YONEKURA ISAO ; NOHAMA SHIYOUJI ; TAMURA AKIRA ; ITOU KOUJIROU ; NAKANO HIROYUKI ; IWASE KAZUYA ; KUNIYA SHINJI ; MORIYA SHIGERU ; KITAGAWA TETSUYA</creator><creatorcontrib>SUSA TAKASHI ; YONEKURA ISAO ; NOHAMA SHIYOUJI ; TAMURA AKIRA ; ITOU KOUJIROU ; NAKANO HIROYUKI ; IWASE KAZUYA ; KUNIYA SHINJI ; MORIYA SHIGERU ; KITAGAWA TETSUYA</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide an inspection method for effectively inspecting foreign matter bonded to the side wall of a support part or beam of a stencil mask by a simple method, and to provide an inspection device therefor. SOLUTION: In the method for inspecting the side wall (21) of the support frame (19) or beam (18) substantially vertically formed with respect to the surface of the stencil mark (10), an imaging means (41) is arranged so that the optical axis (38) thereof is inclined at a predetermined angle (θ) in the direction vertical to the surface of the stencil mask and a plurality of images are taken by changing the focal position of the imaging means with respect to the side wall of the support frame (19) or beam (18) while the whole focal image related to the sided wall of the support frame (19) or beam (18) is synthesized from a plurality of the images to be displayed by a display means (51). COPYRIGHT: (C)2006,JPO&amp;NCIPI</description><language>eng</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; BASIC ELECTRIC ELEMENTS ; CINEMATOGRAPHY ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROGRAPHY ; HOLOGRAPHY ; INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES ; MATERIALS THEREFOR ; MEASURING ; MEASURING ANGLES ; MEASURING AREAS ; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS ; MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; SEMICONDUCTOR DEVICES ; TESTING</subject><creationdate>2006</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20060216&amp;DB=EPODOC&amp;CC=JP&amp;NR=2006046944A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20060216&amp;DB=EPODOC&amp;CC=JP&amp;NR=2006046944A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SUSA TAKASHI</creatorcontrib><creatorcontrib>YONEKURA ISAO</creatorcontrib><creatorcontrib>NOHAMA SHIYOUJI</creatorcontrib><creatorcontrib>TAMURA AKIRA</creatorcontrib><creatorcontrib>ITOU KOUJIROU</creatorcontrib><creatorcontrib>NAKANO HIROYUKI</creatorcontrib><creatorcontrib>IWASE KAZUYA</creatorcontrib><creatorcontrib>KUNIYA SHINJI</creatorcontrib><creatorcontrib>MORIYA SHIGERU</creatorcontrib><creatorcontrib>KITAGAWA TETSUYA</creatorcontrib><title>METHOD AND APPARATUS FOR INSPECTING FOREIGN MATTER OF SIDE WALL OF OPENING OF STENCIL MASK</title><description>PROBLEM TO BE SOLVED: To provide an inspection method for effectively inspecting foreign matter bonded to the side wall of a support part or beam of a stencil mask by a simple method, and to provide an inspection device therefor. SOLUTION: In the method for inspecting the side wall (21) of the support frame (19) or beam (18) substantially vertically formed with respect to the surface of the stencil mark (10), an imaging means (41) is arranged so that the optical axis (38) thereof is inclined at a predetermined angle (θ) in the direction vertical to the surface of the stencil mask and a plurality of images are taken by changing the focal position of the imaging means with respect to the side wall of the support frame (19) or beam (18) while the whole focal image related to the sided wall of the support frame (19) or beam (18) is synthesized from a plurality of the images to be displayed by a display means (51). COPYRIGHT: (C)2006,JPO&amp;NCIPI</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CINEMATOGRAPHY</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</subject><subject>MATERIALS THEREFOR</subject><subject>MEASURING</subject><subject>MEASURING ANGLES</subject><subject>MEASURING AREAS</subject><subject>MEASURING IRREGULARITIES OF SURFACES OR CONTOURS</subject><subject>MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2006</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZIjydQ3x8HdRcPQD4oAAxyDHkNBgBTf_IAVPv-AAV-cQTz93ENfV091PwdcxJMQ1SMHfTSHY08VVIdzRxwfE8Q9w9QMpA4mHuPo5e_oAVQZ78zCwpiXmFKfyQmluBiU31xBnD93Ugvz41OKCxOTUvNSSeK8AIwMDMwMTM0sTE0djohQBAIPFMdQ</recordid><startdate>20060216</startdate><enddate>20060216</enddate><creator>SUSA TAKASHI</creator><creator>YONEKURA ISAO</creator><creator>NOHAMA SHIYOUJI</creator><creator>TAMURA AKIRA</creator><creator>ITOU KOUJIROU</creator><creator>NAKANO HIROYUKI</creator><creator>IWASE KAZUYA</creator><creator>KUNIYA SHINJI</creator><creator>MORIYA SHIGERU</creator><creator>KITAGAWA TETSUYA</creator><scope>EVB</scope></search><sort><creationdate>20060216</creationdate><title>METHOD AND APPARATUS FOR INSPECTING FOREIGN MATTER OF SIDE WALL OF OPENING OF STENCIL MASK</title><author>SUSA TAKASHI ; YONEKURA ISAO ; NOHAMA SHIYOUJI ; TAMURA AKIRA ; ITOU KOUJIROU ; NAKANO HIROYUKI ; IWASE KAZUYA ; KUNIYA SHINJI ; MORIYA SHIGERU ; KITAGAWA TETSUYA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2006046944A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2006</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CINEMATOGRAPHY</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</topic><topic>MATERIALS THEREFOR</topic><topic>MEASURING</topic><topic>MEASURING ANGLES</topic><topic>MEASURING AREAS</topic><topic>MEASURING IRREGULARITIES OF SURFACES OR CONTOURS</topic><topic>MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>SUSA TAKASHI</creatorcontrib><creatorcontrib>YONEKURA ISAO</creatorcontrib><creatorcontrib>NOHAMA SHIYOUJI</creatorcontrib><creatorcontrib>TAMURA AKIRA</creatorcontrib><creatorcontrib>ITOU KOUJIROU</creatorcontrib><creatorcontrib>NAKANO HIROYUKI</creatorcontrib><creatorcontrib>IWASE KAZUYA</creatorcontrib><creatorcontrib>KUNIYA SHINJI</creatorcontrib><creatorcontrib>MORIYA SHIGERU</creatorcontrib><creatorcontrib>KITAGAWA TETSUYA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SUSA TAKASHI</au><au>YONEKURA ISAO</au><au>NOHAMA SHIYOUJI</au><au>TAMURA AKIRA</au><au>ITOU KOUJIROU</au><au>NAKANO HIROYUKI</au><au>IWASE KAZUYA</au><au>KUNIYA SHINJI</au><au>MORIYA SHIGERU</au><au>KITAGAWA TETSUYA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD AND APPARATUS FOR INSPECTING FOREIGN MATTER OF SIDE WALL OF OPENING OF STENCIL MASK</title><date>2006-02-16</date><risdate>2006</risdate><abstract>PROBLEM TO BE SOLVED: To provide an inspection method for effectively inspecting foreign matter bonded to the side wall of a support part or beam of a stencil mask by a simple method, and to provide an inspection device therefor. SOLUTION: In the method for inspecting the side wall (21) of the support frame (19) or beam (18) substantially vertically formed with respect to the surface of the stencil mark (10), an imaging means (41) is arranged so that the optical axis (38) thereof is inclined at a predetermined angle (θ) in the direction vertical to the surface of the stencil mask and a plurality of images are taken by changing the focal position of the imaging means with respect to the side wall of the support frame (19) or beam (18) while the whole focal image related to the sided wall of the support frame (19) or beam (18) is synthesized from a plurality of the images to be displayed by a display means (51). COPYRIGHT: (C)2006,JPO&amp;NCIPI</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_JP2006046944A
source esp@cenet
subjects APPARATUS SPECIALLY ADAPTED THEREFOR
BASIC ELECTRIC ELEMENTS
CINEMATOGRAPHY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES
MATERIALS THEREFOR
MEASURING
MEASURING ANGLES
MEASURING AREAS
MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
SEMICONDUCTOR DEVICES
TESTING
title METHOD AND APPARATUS FOR INSPECTING FOREIGN MATTER OF SIDE WALL OF OPENING OF STENCIL MASK
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-26T13%3A27%3A19IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=SUSA%20TAKASHI&rft.date=2006-02-16&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2006046944A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true