SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To hardly damage terminals and near positions thereof relating to a semiconductor device and a method of manufacturing the semiconductor device. SOLUTION: The semiconductor device is provided with a semiconductor element, resin 22 for sealing the semiconductor element, and term...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	MATAE YOUICHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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