ELECTRONIC INSTRUMENT

ELECTRONIC INSTRUMENT

PROBLEM TO BE SOLVED: To solve a problem that a conventional electronic instrument has equipped with a shield for shielding noise radiated from a printed circuit board with electronic components mounted thereon, however, the shield is not suitable for miniaturization or cost reduction. SOLUTION: One...

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1. Verfasser: HASUMI YUICHI
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Sprache:eng
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator HASUMI YUICHI
description PROBLEM TO BE SOLVED: To solve a problem that a conventional electronic instrument has equipped with a shield for shielding noise radiated from a printed circuit board with electronic components mounted thereon, however, the shield is not suitable for miniaturization or cost reduction. SOLUTION: One surface of the surface wiring layer of the printed circuit board 1 is constituted of a first layer grounding pattern 2, a component installing part 8, a battery frame attaching hole 7, and a battery connecting pattern. The first layer grounding pattern 2 is provided on the substantially whole surface excluding the component installing part 8, the battery frame attaching hole 7, and the battery connecting pattern of the printed circuit board 1. Further, the printed circuit board 1 is provided with an end face plated part 9 applied with plating treatment, while the first layer grounding pattern 2 and a fourth layer grounding pattern 12 are connected to the end plated part 9 to constitute a configuration for covering one surface as well as the end surface and the other surface of the printed circuit board 1. COPYRIGHT: (C)2006,JPO&NCIPI
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2006041294A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2006041294A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2006041294A3</originalsourceid><addsrcrecordid>eNrjZBB19XF1Dgny9_N0VvD0Cw4JCvV19QvhYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxXgFGBgZmBiaGRpYmjsZEKQIA6tIfiQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>ELECTRONIC INSTRUMENT</title><source>esp@cenet</source><creator>HASUMI YUICHI</creator><creatorcontrib>HASUMI YUICHI</creatorcontrib><description>PROBLEM TO BE SOLVED: To solve a problem that a conventional electronic instrument has equipped with a shield for shielding noise radiated from a printed circuit board with electronic components mounted thereon, however, the shield is not suitable for miniaturization or cost reduction. SOLUTION: One surface of the surface wiring layer of the printed circuit board 1 is constituted of a first layer grounding pattern 2, a component installing part 8, a battery frame attaching hole 7, and a battery connecting pattern. The first layer grounding pattern 2 is provided on the substantially whole surface excluding the component installing part 8, the battery frame attaching hole 7, and the battery connecting pattern of the printed circuit board 1. Further, the printed circuit board 1 is provided with an end face plated part 9 applied with plating treatment, while the first layer grounding pattern 2 and a fourth layer grounding pattern 12 are connected to the end plated part 9 to constitute a configuration for covering one surface as well as the end surface and the other surface of the printed circuit board 1. COPYRIGHT: (C)2006,JPO&amp;NCIPI</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2006</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20060209&amp;DB=EPODOC&amp;CC=JP&amp;NR=2006041294A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20060209&amp;DB=EPODOC&amp;CC=JP&amp;NR=2006041294A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HASUMI YUICHI</creatorcontrib><title>ELECTRONIC INSTRUMENT</title><description>PROBLEM TO BE SOLVED: To solve a problem that a conventional electronic instrument has equipped with a shield for shielding noise radiated from a printed circuit board with electronic components mounted thereon, however, the shield is not suitable for miniaturization or cost reduction. SOLUTION: One surface of the surface wiring layer of the printed circuit board 1 is constituted of a first layer grounding pattern 2, a component installing part 8, a battery frame attaching hole 7, and a battery connecting pattern. The first layer grounding pattern 2 is provided on the substantially whole surface excluding the component installing part 8, the battery frame attaching hole 7, and the battery connecting pattern of the printed circuit board 1. Further, the printed circuit board 1 is provided with an end face plated part 9 applied with plating treatment, while the first layer grounding pattern 2 and a fourth layer grounding pattern 12 are connected to the end plated part 9 to constitute a configuration for covering one surface as well as the end surface and the other surface of the printed circuit board 1. COPYRIGHT: (C)2006,JPO&amp;NCIPI</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2006</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBB19XF1Dgny9_N0VvD0Cw4JCvV19QvhYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxXgFGBgZmBiaGRpYmjsZEKQIA6tIfiQ</recordid><startdate>20060209</startdate><enddate>20060209</enddate><creator>HASUMI YUICHI</creator><scope>EVB</scope></search><sort><creationdate>20060209</creationdate><title>ELECTRONIC INSTRUMENT</title><author>HASUMI YUICHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2006041294A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2006</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>HASUMI YUICHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HASUMI YUICHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ELECTRONIC INSTRUMENT</title><date>2006-02-09</date><risdate>2006</risdate><abstract>PROBLEM TO BE SOLVED: To solve a problem that a conventional electronic instrument has equipped with a shield for shielding noise radiated from a printed circuit board with electronic components mounted thereon, however, the shield is not suitable for miniaturization or cost reduction. SOLUTION: One surface of the surface wiring layer of the printed circuit board 1 is constituted of a first layer grounding pattern 2, a component installing part 8, a battery frame attaching hole 7, and a battery connecting pattern. The first layer grounding pattern 2 is provided on the substantially whole surface excluding the component installing part 8, the battery frame attaching hole 7, and the battery connecting pattern of the printed circuit board 1. Further, the printed circuit board 1 is provided with an end face plated part 9 applied with plating treatment, while the first layer grounding pattern 2 and a fourth layer grounding pattern 12 are connected to the end plated part 9 to constitute a configuration for covering one surface as well as the end surface and the other surface of the printed circuit board 1. COPYRIGHT: (C)2006,JPO&amp;NCIPI</abstract><oa>free_for_read</oa></addata></record>
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title ELECTRONIC INSTRUMENT
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-24T21%3A03%3A18IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=HASUMI%20YUICHI&rft.date=2006-02-09&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2006041294A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true