NICKEL-COATED COPPER POWDER AND METHOD FOR PRODUCING NICKEL-COATED COPPER POWDER
PROBLEM TO BE SOLVED: To provide oxidation resistant nickel-coated copper powder for electrically conductive paste for forming an electrically conductive wiring part for an electronic circuit, and to provide a method for producing the same. SOLUTION: The nickel-coated copper powder contains nickel-c...
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| creator | YOSHIMARU KATSUHIKO FURUMOTO KEITA SAKAGAMI TAKAHIKO |
| description | PROBLEM TO BE SOLVED: To provide oxidation resistant nickel-coated copper powder for electrically conductive paste for forming an electrically conductive wiring part for an electronic circuit, and to provide a method for producing the same. SOLUTION: The nickel-coated copper powder contains nickel-coated copper grains obtained by using copper grains as a core material, sticking a catalyst for plating to the surface of each copper grain by reduction reaction, and applying electroless nickel plating to the outermost surface. In the reduction reaction, hydrazine is used as a reducing agent. COPYRIGHT: (C)2006,JPO&NCIPI |
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SOLUTION: The nickel-coated copper powder contains nickel-coated copper grains obtained by using copper grains as a core material, sticking a catalyst for plating to the surface of each copper grain by reduction reaction, and applying electroless nickel plating to the outermost surface. In the reduction reaction, hydrazine is used as a reducing agent. 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SOLUTION: The nickel-coated copper powder contains nickel-coated copper grains obtained by using copper grains as a core material, sticking a catalyst for plating to the surface of each copper grain by reduction reaction, and applying electroless nickel plating to the outermost surface. In the reduction reaction, hydrazine is used as a reducing agent. COPYRIGHT: (C)2006,JPO&NCIPI</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CABLES</subject><subject>CASTING</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>CONDUCTORS</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRICITY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>INSULATORS</subject><subject>MAKING METALLIC POWDER</subject><subject>MANUFACTURE OF ARTICLES FROM METALLIC POWDER</subject><subject>METALLURGY</subject><subject>PERFORMING OPERATIONS</subject><subject>POWDER METALLURGY</subject><subject>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><subject>TRANSPORTING</subject><subject>WORKING METALLIC POWDER</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2006</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZAjw83T2dvXRdfZ3DHF1UXD2DwhwDVII8A93AVKOfi4Kvq4hHv4uCm7-QNEgf5dQZ08_dwU8mngYWNMSc4pTeaE0N4OSm2uIs4duakF-fGpxQWJyal5qSbxXgJGBgZmBkYWZsYGjMVGKALIML0E</recordid><startdate>20060202</startdate><enddate>20060202</enddate><creator>YOSHIMARU KATSUHIKO</creator><creator>FURUMOTO KEITA</creator><creator>SAKAGAMI TAKAHIKO</creator><scope>EVB</scope></search><sort><creationdate>20060202</creationdate><title>NICKEL-COATED COPPER POWDER AND METHOD FOR PRODUCING NICKEL-COATED COPPER POWDER</title><author>YOSHIMARU KATSUHIKO ; FURUMOTO KEITA ; SAKAGAMI TAKAHIKO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2006028630A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2006</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CABLES</topic><topic>CASTING</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>CONDUCTORS</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>INSULATORS</topic><topic>MAKING METALLIC POWDER</topic><topic>MANUFACTURE OF ARTICLES FROM METALLIC POWDER</topic><topic>METALLURGY</topic><topic>PERFORMING OPERATIONS</topic><topic>POWDER METALLURGY</topic><topic>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><topic>TRANSPORTING</topic><topic>WORKING METALLIC POWDER</topic><toplevel>online_resources</toplevel><creatorcontrib>YOSHIMARU KATSUHIKO</creatorcontrib><creatorcontrib>FURUMOTO KEITA</creatorcontrib><creatorcontrib>SAKAGAMI TAKAHIKO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YOSHIMARU KATSUHIKO</au><au>FURUMOTO KEITA</au><au>SAKAGAMI TAKAHIKO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>NICKEL-COATED COPPER POWDER AND METHOD FOR PRODUCING NICKEL-COATED COPPER POWDER</title><date>2006-02-02</date><risdate>2006</risdate><abstract>PROBLEM TO BE SOLVED: To provide oxidation resistant nickel-coated copper powder for electrically conductive paste for forming an electrically conductive wiring part for an electronic circuit, and to provide a method for producing the same. SOLUTION: The nickel-coated copper powder contains nickel-coated copper grains obtained by using copper grains as a core material, sticking a catalyst for plating to the surface of each copper grain by reduction reaction, and applying electroless nickel plating to the outermost surface. In the reduction reaction, hydrazine is used as a reducing agent. COPYRIGHT: (C)2006,JPO&NCIPI</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CABLES CASTING CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL CONDUCTORS DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL INSULATORS MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER METALLURGY PERFORMING OPERATIONS POWDER METALLURGY SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING WORKING METALLIC POWDER |
| title | NICKEL-COATED COPPER POWDER AND METHOD FOR PRODUCING NICKEL-COATED COPPER POWDER |
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