ELECTRICALLY ANISOTROPIC CONDUCTIVE HOT-MELT ADHESIVE SHEET USED FOR BURYING ELECTRICAL MODULE IN CARD MAIN BODY
PROBLEM TO BE SOLVED: To provide an electrically anisotropic conductive adhesive sheet capable of enduring temperature change and capable of being used for burying an electrical module in a card main body. SOLUTION: This adhesive sheet used, especially, for bonding and joining the electrical module...
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | HUSEMANN MARC MAREN KLOSE |
| description | PROBLEM TO BE SOLVED: To provide an electrically anisotropic conductive adhesive sheet capable of enduring temperature change and capable of being used for burying an electrical module in a card main body. SOLUTION: This adhesive sheet used, especially, for bonding and joining the electrical module to the inside of the card main body is composed of at least one layer of an adhesive system which uses at least one kind of an adhesive capable of being thermally activated as a base material, wherein the adhesive system satisfies requisites (1) to (3) as follows: (1) a softening temperature of the adhesive system is positioned in a range of 65 to 165°C; (2) conductive particles are mixed with the adhesive system, wherein the particles have an average particle diameter of 25-100 μm (provided that the average particle diameter of the conductive particles is larger than a thickness of the layer of the adhesive system); and (3) the conductive particles have each a core of copper or zinc. COPYRIGHT: (C)2006,JPO&NCIPI |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2006002150A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2006002150A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2006002150A3</originalsourceid><addsrcrecordid>eNqNjLEKwjAURbs4iPoPD_dCrOieJq8mkuZJ8iJ0KkXiJFqo_48KgqvTPRwOd16M6FBxsEo614H0NhIHOlkFirxOiu0ZwRCXLToGqQ3Gj4kGkSFF1NBQgDqFzvoD_M6gJZ0cgvWgZNDQyjfVpLtlMbsOtymvvrso1g2yMmUeH32exuGS7_nZH0-VEHshqs1OyO1f0QtR-TgN</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>ELECTRICALLY ANISOTROPIC CONDUCTIVE HOT-MELT ADHESIVE SHEET USED FOR BURYING ELECTRICAL MODULE IN CARD MAIN BODY</title><source>esp@cenet</source><creator>HUSEMANN MARC ; MAREN KLOSE</creator><creatorcontrib>HUSEMANN MARC ; MAREN KLOSE</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide an electrically anisotropic conductive adhesive sheet capable of enduring temperature change and capable of being used for burying an electrical module in a card main body. SOLUTION: This adhesive sheet used, especially, for bonding and joining the electrical module to the inside of the card main body is composed of at least one layer of an adhesive system which uses at least one kind of an adhesive capable of being thermally activated as a base material, wherein the adhesive system satisfies requisites (1) to (3) as follows: (1) a softening temperature of the adhesive system is positioned in a range of 65 to 165°C; (2) conductive particles are mixed with the adhesive system, wherein the particles have an average particle diameter of 25-100 μm (provided that the average particle diameter of the conductive particles is larger than a thickness of the layer of the adhesive system); and (3) the conductive particles have each a core of copper or zinc. COPYRIGHT: (C)2006,JPO&NCIPI</description><language>eng</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G ; BASIC ELECTRIC ELEMENTS ; CALCULATING ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPUTING ; COUNTING ; CURRENT COLLECTORS ; DYES ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GENERAL PROCESSES OF COMPOUNDING ; HANDLING RECORD CARRIERS ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; LINE CONNECTORS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; PERFORMING OPERATIONS ; PHYSICS ; POLISHES ; PRESENTATION OF DATA ; PRINTED CIRCUITS ; RECOGNITION OF DATA ; RECORD CARRIERS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; TRANSPORTING ; USE OF MATERIALS AS ADHESIVES ; WORKING-UP</subject><creationdate>2006</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20060105&DB=EPODOC&CC=JP&NR=2006002150A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20060105&DB=EPODOC&CC=JP&NR=2006002150A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HUSEMANN MARC</creatorcontrib><creatorcontrib>MAREN KLOSE</creatorcontrib><title>ELECTRICALLY ANISOTROPIC CONDUCTIVE HOT-MELT ADHESIVE SHEET USED FOR BURYING ELECTRICAL MODULE IN CARD MAIN BODY</title><description>PROBLEM TO BE SOLVED: To provide an electrically anisotropic conductive adhesive sheet capable of enduring temperature change and capable of being used for burying an electrical module in a card main body. SOLUTION: This adhesive sheet used, especially, for bonding and joining the electrical module to the inside of the card main body is composed of at least one layer of an adhesive system which uses at least one kind of an adhesive capable of being thermally activated as a base material, wherein the adhesive system satisfies requisites (1) to (3) as follows: (1) a softening temperature of the adhesive system is positioned in a range of 65 to 165°C; (2) conductive particles are mixed with the adhesive system, wherein the particles have an average particle diameter of 25-100 μm (provided that the average particle diameter of the conductive particles is larger than a thickness of the layer of the adhesive system); and (3) the conductive particles have each a core of copper or zinc. COPYRIGHT: (C)2006,JPO&NCIPI</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CALCULATING</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>CURRENT COLLECTORS</subject><subject>DYES</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>GENERAL PROCESSES OF COMPOUNDING</subject><subject>HANDLING RECORD CARRIERS</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>LINE CONNECTORS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PAINTS</subject><subject>PERFORMING OPERATIONS</subject><subject>PHYSICS</subject><subject>POLISHES</subject><subject>PRESENTATION OF DATA</subject><subject>PRINTED CIRCUITS</subject><subject>RECOGNITION OF DATA</subject><subject>RECORD CARRIERS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>TRANSPORTING</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><subject>WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2006</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjLEKwjAURbs4iPoPD_dCrOieJq8mkuZJ8iJ0KkXiJFqo_48KgqvTPRwOd16M6FBxsEo614H0NhIHOlkFirxOiu0ZwRCXLToGqQ3Gj4kGkSFF1NBQgDqFzvoD_M6gJZ0cgvWgZNDQyjfVpLtlMbsOtymvvrso1g2yMmUeH32exuGS7_nZH0-VEHshqs1OyO1f0QtR-TgN</recordid><startdate>20060105</startdate><enddate>20060105</enddate><creator>HUSEMANN MARC</creator><creator>MAREN KLOSE</creator><scope>EVB</scope></search><sort><creationdate>20060105</creationdate><title>ELECTRICALLY ANISOTROPIC CONDUCTIVE HOT-MELT ADHESIVE SHEET USED FOR BURYING ELECTRICAL MODULE IN CARD MAIN BODY</title><author>HUSEMANN MARC ; MAREN KLOSE</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2006002150A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2006</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CALCULATING</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>CURRENT COLLECTORS</topic><topic>DYES</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>GENERAL PROCESSES OF COMPOUNDING</topic><topic>HANDLING RECORD CARRIERS</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>LINE CONNECTORS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>PERFORMING OPERATIONS</topic><topic>PHYSICS</topic><topic>POLISHES</topic><topic>PRESENTATION OF DATA</topic><topic>PRINTED CIRCUITS</topic><topic>RECOGNITION OF DATA</topic><topic>RECORD CARRIERS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>TRANSPORTING</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><topic>WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>HUSEMANN MARC</creatorcontrib><creatorcontrib>MAREN KLOSE</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HUSEMANN MARC</au><au>MAREN KLOSE</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ELECTRICALLY ANISOTROPIC CONDUCTIVE HOT-MELT ADHESIVE SHEET USED FOR BURYING ELECTRICAL MODULE IN CARD MAIN BODY</title><date>2006-01-05</date><risdate>2006</risdate><abstract>PROBLEM TO BE SOLVED: To provide an electrically anisotropic conductive adhesive sheet capable of enduring temperature change and capable of being used for burying an electrical module in a card main body. SOLUTION: This adhesive sheet used, especially, for bonding and joining the electrical module to the inside of the card main body is composed of at least one layer of an adhesive system which uses at least one kind of an adhesive capable of being thermally activated as a base material, wherein the adhesive system satisfies requisites (1) to (3) as follows: (1) a softening temperature of the adhesive system is positioned in a range of 65 to 165°C; (2) conductive particles are mixed with the adhesive system, wherein the particles have an average particle diameter of 25-100 μm (provided that the average particle diameter of the conductive particles is larger than a thickness of the layer of the adhesive system); and (3) the conductive particles have each a core of copper or zinc. COPYRIGHT: (C)2006,JPO&NCIPI</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_JP2006002150A |
| source | esp@cenet |
| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPUTING COUNTING CURRENT COLLECTORS DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING HANDLING RECORD CARRIERS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PERFORMING OPERATIONS PHYSICS POLISHES PRESENTATION OF DATA PRINTED CIRCUITS RECOGNITION OF DATA RECORD CARRIERS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF MATERIALS AS ADHESIVES WORKING-UP |
| title | ELECTRICALLY ANISOTROPIC CONDUCTIVE HOT-MELT ADHESIVE SHEET USED FOR BURYING ELECTRICAL MODULE IN CARD MAIN BODY |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-28T14%3A09%3A20IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=HUSEMANN%20MARC&rft.date=2006-01-05&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2006002150A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |