WIRING BOARD AND SEMICONDUCTOR DEVICE USING THE SAME

PROBLEM TO BE SOLVED: To provide a technology of relaxing the positioning accuracy between a flip-chip mounted semiconductor element and a wiring board, and improving the connection positional accuracy and the connection reliability between bumps of the semiconductor element and connection terminals...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	TAKEOKA YOSHIAKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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