MULTILAYERED WIRING BOARD AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a multilayered wiring board and its manufacturing method for connecting a large number of micro-machining structures of high integration and densification independently and electrically to an external system, and forming the micro-machining structure of a wiring material drivable at high voltage in the method of manufacturing the multilayered wiring board. SOLUTION: The method of manufacturing the multilayered wiring board comprises processes for: manufacturing the large number of micro-machining structures 11 on a board 10 by a micro-machining technology; manufacturing lower wiring 14 connected onto the micro-machining structures 11 by lift-off using first sacrificial metal films 12; manufacturing posts 16 connected onto the lower wiring 16 by electroplating using the first sacrificial metal films 12; manufacturing layer insulating films 17 on the lower wiring 14 and around the posts 16 by sputtering; and integrally manufacturing upper wiring 18 connected onto the posts 16, and a pad 19 connected to the external system by lift-off using second sacrificial metal films. COPYRIGHT: (C)2006,JPO&NCIPI