ADHESIVE COMPOSITION, FILM-TYPE ADHESIVE AGENT AND CIRCUIT CONNECTING MATERIAL USING THE SAME AND CONNECTION STRUCTURE OF CIRCUIT MATERIAL AND ITS PREPARATION METHOD
PROBLEM TO BE SOLVED: To provide an adhesive agent composition showing a sufficiently rapid curing property at low temperatures and suppression of curing reaction immediately after being irradiated by active ray as well, and also to provide a film-type adhesive agent and a circuit connecting materia...
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | YUSA MASAMI KAWAKAMI SUSUMU |
| description | PROBLEM TO BE SOLVED: To provide an adhesive agent composition showing a sufficiently rapid curing property at low temperatures and suppression of curing reaction immediately after being irradiated by active ray as well, and also to provide a film-type adhesive agent and a circuit connecting material using the same, a connecting structure of circuit materials using the above circuit connecting materials and a preparation process of the above structure. SOLUTION: The adhesive agent comprises an oxetane compound, a curing agent and a basic compound. COPYRIGHT: (C)2006,JPO&NCIPI |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2005325312A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2005325312A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2005325312A3</originalsourceid><addsrcrecordid>eNqNjEsKwkAQRLNxIeodGtcGYoIHaCadpMX5MNMRXInIuBINxCt5T41K1q6Kot6rafLEsqHAewJltbOBha1ZQcU7ncrBEYw71mQE0JSg2KuW5W0YQ0rY1KBRyDPuoA1DlYYgoKYv_sOsgSC-VdJ6AluNN6M7wCwBnCeHHj-GJmlsOU8ml9O1j4tfzpJlRaKaNHb3Y-y70zne4uO4dXmWbYp8U6xzLP6CXlVyRqQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>ADHESIVE COMPOSITION, FILM-TYPE ADHESIVE AGENT AND CIRCUIT CONNECTING MATERIAL USING THE SAME AND CONNECTION STRUCTURE OF CIRCUIT MATERIAL AND ITS PREPARATION METHOD</title><source>esp@cenet</source><creator>YUSA MASAMI ; KAWAKAMI SUSUMU</creator><creatorcontrib>YUSA MASAMI ; KAWAKAMI SUSUMU</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide an adhesive agent composition showing a sufficiently rapid curing property at low temperatures and suppression of curing reaction immediately after being irradiated by active ray as well, and also to provide a film-type adhesive agent and a circuit connecting material using the same, a connecting structure of circuit materials using the above circuit connecting materials and a preparation process of the above structure. SOLUTION: The adhesive agent comprises an oxetane compound, a curing agent and a basic compound. COPYRIGHT: (C)2006,JPO&NCIPI</description><edition>7</edition><language>eng</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; DYES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; PAINTS ; POLISHES ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2005</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20051124&DB=EPODOC&CC=JP&NR=2005325312A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25569,76552</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20051124&DB=EPODOC&CC=JP&NR=2005325312A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YUSA MASAMI</creatorcontrib><creatorcontrib>KAWAKAMI SUSUMU</creatorcontrib><title>ADHESIVE COMPOSITION, FILM-TYPE ADHESIVE AGENT AND CIRCUIT CONNECTING MATERIAL USING THE SAME AND CONNECTION STRUCTURE OF CIRCUIT MATERIAL AND ITS PREPARATION METHOD</title><description>PROBLEM TO BE SOLVED: To provide an adhesive agent composition showing a sufficiently rapid curing property at low temperatures and suppression of curing reaction immediately after being irradiated by active ray as well, and also to provide a film-type adhesive agent and a circuit connecting material using the same, a connecting structure of circuit materials using the above circuit connecting materials and a preparation process of the above structure. SOLUTION: The adhesive agent comprises an oxetane compound, a curing agent and a basic compound. COPYRIGHT: (C)2006,JPO&NCIPI</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>DYES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2005</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjEsKwkAQRLNxIeodGtcGYoIHaCadpMX5MNMRXInIuBINxCt5T41K1q6Kot6rafLEsqHAewJltbOBha1ZQcU7ncrBEYw71mQE0JSg2KuW5W0YQ0rY1KBRyDPuoA1DlYYgoKYv_sOsgSC-VdJ6AluNN6M7wCwBnCeHHj-GJmlsOU8ml9O1j4tfzpJlRaKaNHb3Y-y70zne4uO4dXmWbYp8U6xzLP6CXlVyRqQ</recordid><startdate>20051124</startdate><enddate>20051124</enddate><creator>YUSA MASAMI</creator><creator>KAWAKAMI SUSUMU</creator><scope>EVB</scope></search><sort><creationdate>20051124</creationdate><title>ADHESIVE COMPOSITION, FILM-TYPE ADHESIVE AGENT AND CIRCUIT CONNECTING MATERIAL USING THE SAME AND CONNECTION STRUCTURE OF CIRCUIT MATERIAL AND ITS PREPARATION METHOD</title><author>YUSA MASAMI ; KAWAKAMI SUSUMU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2005325312A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2005</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>DYES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>YUSA MASAMI</creatorcontrib><creatorcontrib>KAWAKAMI SUSUMU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YUSA MASAMI</au><au>KAWAKAMI SUSUMU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ADHESIVE COMPOSITION, FILM-TYPE ADHESIVE AGENT AND CIRCUIT CONNECTING MATERIAL USING THE SAME AND CONNECTION STRUCTURE OF CIRCUIT MATERIAL AND ITS PREPARATION METHOD</title><date>2005-11-24</date><risdate>2005</risdate><abstract>PROBLEM TO BE SOLVED: To provide an adhesive agent composition showing a sufficiently rapid curing property at low temperatures and suppression of curing reaction immediately after being irradiated by active ray as well, and also to provide a film-type adhesive agent and a circuit connecting material using the same, a connecting structure of circuit materials using the above circuit connecting materials and a preparation process of the above structure. SOLUTION: The adhesive agent comprises an oxetane compound, a curing agent and a basic compound. COPYRIGHT: (C)2006,JPO&NCIPI</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_JP2005325312A |
| source | esp@cenet |
| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES PRINTED CIRCUITS SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES |
| title | ADHESIVE COMPOSITION, FILM-TYPE ADHESIVE AGENT AND CIRCUIT CONNECTING MATERIAL USING THE SAME AND CONNECTION STRUCTURE OF CIRCUIT MATERIAL AND ITS PREPARATION METHOD |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-14T19%3A32%3A36IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=YUSA%20MASAMI&rft.date=2005-11-24&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2005325312A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |