ADHESIVE COMPOSITION, FILM-TYPE ADHESIVE AGENT AND CIRCUIT CONNECTING MATERIAL USING THE SAME AND CONNECTION STRUCTURE OF CIRCUIT MATERIAL AND ITS PREPARATION METHOD

PROBLEM TO BE SOLVED: To provide an adhesive agent composition showing a sufficiently rapid curing property at low temperatures and suppression of curing reaction immediately after being irradiated by active ray as well, and also to provide a film-type adhesive agent and a circuit connecting materia...

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Bibliographische Detailangaben
Hauptverfasser:	YUSA MASAMI, KAWAKAMI SUSUMU
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES PRINTED CIRCUITS SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an adhesive agent composition showing a sufficiently rapid curing property at low temperatures and suppression of curing reaction immediately after being irradiated by active ray as well, and also to provide a film-type adhesive agent and a circuit connecting material using the same, a connecting structure of circuit materials using the above circuit connecting materials and a preparation process of the above structure. SOLUTION: The adhesive agent comprises an oxetane compound, a curing agent and a basic compound. COPYRIGHT: (C)2006,JPO&NCIPI