FINE PROCESSING METHOD AND FINE PROCESSING DEVICE
PROBLEM TO BE SOLVED: To provide a fine processing method for manufacturing a thin-film workpiece with high processing accuracy; and to provide its device. SOLUTION: A processing cross-sectional surface 10 of a workpiece 4 is formed on an ion beam-irradiated side surface 26 obtained by moving a radi...
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| description | PROBLEM TO BE SOLVED: To provide a fine processing method for manufacturing a thin-film workpiece with high processing accuracy; and to provide its device. SOLUTION: A processing cross-sectional surface 10 of a workpiece 4 is formed on an ion beam-irradiated side surface 26 obtained by moving a radiation axis 24 of an ion beam 20 along a processing line. An image of an object 8 located in the workpiece 4 is captured by radiating an electron beam 30. Images of first and second parts in the captured image are compared with each other to determine which of the thickness of a covering part 16 from the processing cross-sectional surface 10 to the surface of the first part and the thickness of a covering part 16 from the processing cross-sectional surface 10 to the surface of the second part is larger. At least either of the direction of the processing line and the angle of the radiation axis 24 is changed so that the ion beam-irradiated side surface 26 significantly approaches a direction toward the other side out of the first and second parts where the covering part 16 is thicker rather than a direction toward one side where the covering part 16 is thinner. The workpiece 4 is processed again by moving the processing line. COPYRIGHT: (C)2006,JPO&NCIPI |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2005317330A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2005317330A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2005317330A3</originalsourceid><addsrcrecordid>eNrjZDB08_RzVQgI8nd2DQ729HNX8HUN8fB3UXD0c1FAl3JxDfN0duVhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfFeAUYGBqbGhubGxgaOxkQpAgCIjCa-</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>FINE PROCESSING METHOD AND FINE PROCESSING DEVICE</title><source>esp@cenet</source><creator>INUI MITSUTAKA</creator><creatorcontrib>INUI MITSUTAKA</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a fine processing method for manufacturing a thin-film workpiece with high processing accuracy; and to provide its device. SOLUTION: A processing cross-sectional surface 10 of a workpiece 4 is formed on an ion beam-irradiated side surface 26 obtained by moving a radiation axis 24 of an ion beam 20 along a processing line. An image of an object 8 located in the workpiece 4 is captured by radiating an electron beam 30. Images of first and second parts in the captured image are compared with each other to determine which of the thickness of a covering part 16 from the processing cross-sectional surface 10 to the surface of the first part and the thickness of a covering part 16 from the processing cross-sectional surface 10 to the surface of the second part is larger. At least either of the direction of the processing line and the angle of the radiation axis 24 is changed so that the ion beam-irradiated side surface 26 significantly approaches a direction toward the other side out of the first and second parts where the covering part 16 is thicker rather than a direction toward one side where the covering part 16 is thinner. The workpiece 4 is processed again by moving the processing line. COPYRIGHT: (C)2006,JPO&NCIPI</description><edition>7</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ; ELECTRICITY ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; MICROSTRUCTURAL TECHNOLOGY ; PERFORMING OPERATIONS ; PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2005</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20051110&DB=EPODOC&CC=JP&NR=2005317330A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20051110&DB=EPODOC&CC=JP&NR=2005317330A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>INUI MITSUTAKA</creatorcontrib><title>FINE PROCESSING METHOD AND FINE PROCESSING DEVICE</title><description>PROBLEM TO BE SOLVED: To provide a fine processing method for manufacturing a thin-film workpiece with high processing accuracy; and to provide its device. SOLUTION: A processing cross-sectional surface 10 of a workpiece 4 is formed on an ion beam-irradiated side surface 26 obtained by moving a radiation axis 24 of an ion beam 20 along a processing line. An image of an object 8 located in the workpiece 4 is captured by radiating an electron beam 30. Images of first and second parts in the captured image are compared with each other to determine which of the thickness of a covering part 16 from the processing cross-sectional surface 10 to the surface of the first part and the thickness of a covering part 16 from the processing cross-sectional surface 10 to the surface of the second part is larger. At least either of the direction of the processing line and the angle of the radiation axis 24 is changed so that the ion beam-irradiated side surface 26 significantly approaches a direction toward the other side out of the first and second parts where the covering part 16 is thicker rather than a direction toward one side where the covering part 16 is thinner. The workpiece 4 is processed again by moving the processing line. COPYRIGHT: (C)2006,JPO&NCIPI</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS</subject><subject>ELECTRICITY</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>MICROSTRUCTURAL TECHNOLOGY</subject><subject>PERFORMING OPERATIONS</subject><subject>PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2005</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDB08_RzVQgI8nd2DQ729HNX8HUN8fB3UXD0c1FAl3JxDfN0duVhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfFeAUYGBqbGhubGxgaOxkQpAgCIjCa-</recordid><startdate>20051110</startdate><enddate>20051110</enddate><creator>INUI MITSUTAKA</creator><scope>EVB</scope></search><sort><creationdate>20051110</creationdate><title>FINE PROCESSING METHOD AND FINE PROCESSING DEVICE</title><author>INUI MITSUTAKA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2005317330A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2005</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS</topic><topic>ELECTRICITY</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>MICROSTRUCTURAL TECHNOLOGY</topic><topic>PERFORMING OPERATIONS</topic><topic>PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>INUI MITSUTAKA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>INUI MITSUTAKA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>FINE PROCESSING METHOD AND FINE PROCESSING DEVICE</title><date>2005-11-10</date><risdate>2005</risdate><abstract>PROBLEM TO BE SOLVED: To provide a fine processing method for manufacturing a thin-film workpiece with high processing accuracy; and to provide its device. SOLUTION: A processing cross-sectional surface 10 of a workpiece 4 is formed on an ion beam-irradiated side surface 26 obtained by moving a radiation axis 24 of an ion beam 20 along a processing line. An image of an object 8 located in the workpiece 4 is captured by radiating an electron beam 30. Images of first and second parts in the captured image are compared with each other to determine which of the thickness of a covering part 16 from the processing cross-sectional surface 10 to the surface of the first part and the thickness of a covering part 16 from the processing cross-sectional surface 10 to the surface of the second part is larger. At least either of the direction of the processing line and the angle of the radiation axis 24 is changed so that the ion beam-irradiated side surface 26 significantly approaches a direction toward the other side out of the first and second parts where the covering part 16 is thicker rather than a direction toward one side where the covering part 16 is thinner. The workpiece 4 is processed again by moving the processing line. COPYRIGHT: (C)2006,JPO&NCIPI</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | FINE PROCESSING METHOD AND FINE PROCESSING DEVICE |
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