PACKAGING METHOD AND PACKAGING STRUCTURE OF SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To improve a reliability for connecting an electrode of a semiconductor device with a conductive pattern of a substrate. SOLUTION: A packaging method of the semiconductor device comprises the steps of loading a semiconductor device 2 on one side of the substrate 3 by means of a...

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Bibliographische Detailangaben

1. Verfasser:	MARUYAMA SHIGEKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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