HIGH FREQUENCY PACKAGE

PROBLEM TO BE SOLVED: To avoid influence on a high-frequency characteristic by feedthroughs for a bias/control signal, achieve cost reduction by decreasing the number of feedthroughs, and secure sufficient strength in a high-frequency package. SOLUTION: A high-frequency package has a board 1 on whic...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SATO FUMIHIDE, MORI SHIGEYUKI, YOSHIOKA NOBUO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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