HIGH FREQUENCY PACKAGE

HIGH FREQUENCY PACKAGE

PROBLEM TO BE SOLVED: To avoid influence on a high-frequency characteristic by feedthroughs for a bias/control signal, achieve cost reduction by decreasing the number of feedthroughs, and secure sufficient strength in a high-frequency package. SOLUTION: A high-frequency package has a board 1 on whic...

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Hauptverfasser: SATO FUMIHIDE, MORI SHIGEYUKI, YOSHIOKA NOBUO
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator SATO FUMIHIDE
MORI SHIGEYUKI
YOSHIOKA NOBUO
description PROBLEM TO BE SOLVED: To avoid influence on a high-frequency characteristic by feedthroughs for a bias/control signal, achieve cost reduction by decreasing the number of feedthroughs, and secure sufficient strength in a high-frequency package. SOLUTION: A high-frequency package has a board 1 on which a high-frequency component is mounted, a flame-like wall 2 that is coupled with the board 1 and forms a cavity for storing the high-frequency component, a cover 3 for sealing an opening end of the flame-like wall 2, a high-frequency feedthrough 4 having a high-frequency transmission pattern for transmitting a high-frequency signal inputted into or outputted from the high-frequency component, and feedthroughs for control signal 5 having a plurality of patterns for control signal 6 for supplying a bias or control signal to the high-frequency component; wherein GND patterns 8 formed between the feedthroughs for control signal 5 and the patterns for control signal 6, and electrical connection means 9 for electrically connecting the GND patterns 8 to the board 1 and the flame-like wall 2 are provided. COPYRIGHT: (C)2006,JPO&NCIPI
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title HIGH FREQUENCY PACKAGE
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