MULTIPLE EXPOSURE METHOD, MICROLITHOGRAPHIC PROJECTION ALIGNER, AND PROJECTION SYSTEM

PROBLEM TO BE SOLVED: To provide a multiple exposure method achieving a large throughput of wafer processing, and a microlithographic projection aligner which improves the productivity, at least with unchanging quality and low cost. SOLUTION: In the multiple exposure method for at least one substrat...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: SCHARNWEBER RALF
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator SCHARNWEBER RALF
description PROBLEM TO BE SOLVED: To provide a multiple exposure method achieving a large throughput of wafer processing, and a microlithographic projection aligner which improves the productivity, at least with unchanging quality and low cost. SOLUTION: In the multiple exposure method for at least one substrate covered with a photosensitive layer, first exposure is performed in a first projection system (17) according to an exposure parameter of a first group, and second exposure is performed in a second projection system (18) spatially separated from the first projection system (17). These projection systems are integrated with a common projection aligner (1). For example, the first exposure is performed using an amplitude mask (6), and the second exposure is performed using a phase mask (9). The first exposure and the second exposure are performed in parallel, by using a number of projection systems, thereby achieving multiple exposures which save time. COPYRIGHT: (C)2005,JPO&NCIPI
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2005268781A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2005268781A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2005268781A3</originalsourceid><addsrcrecordid>eNrjZAj1DfUJ8QzwcVVwjQjwDw4NclXwdQ3x8HfRUfD1dA7y9_EEctyDHAM8PJ0VAoL8vVydQzz9_RQcfTzd_VyDdBQc_VyQxYMjg0NcfXkYWNMSc4pTeaE0N4OSm2uIs4duakF-fGpxQWJyal5qSbxXgJGBgamRmYW5haGjMVGKAAlnMWo</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>MULTIPLE EXPOSURE METHOD, MICROLITHOGRAPHIC PROJECTION ALIGNER, AND PROJECTION SYSTEM</title><source>esp@cenet</source><creator>SCHARNWEBER RALF</creator><creatorcontrib>SCHARNWEBER RALF</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a multiple exposure method achieving a large throughput of wafer processing, and a microlithographic projection aligner which improves the productivity, at least with unchanging quality and low cost. SOLUTION: In the multiple exposure method for at least one substrate covered with a photosensitive layer, first exposure is performed in a first projection system (17) according to an exposure parameter of a first group, and second exposure is performed in a second projection system (18) spatially separated from the first projection system (17). These projection systems are integrated with a common projection aligner (1). For example, the first exposure is performed using an amplitude mask (6), and the second exposure is performed using a phase mask (9). The first exposure and the second exposure are performed in parallel, by using a number of projection systems, thereby achieving multiple exposures which save time. COPYRIGHT: (C)2005,JPO&amp;NCIPI</description><edition>7</edition><language>eng</language><subject>ACCESSORIES THEREFOR ; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USINGWAVES OTHER THAN OPTICAL WAVES ; APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FORPROJECTING OR VIEWING THEM ; APPARATUS SPECIALLY ADAPTED THEREFOR ; BASIC ELECTRIC ELEMENTS ; CINEMATOGRAPHY ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROGRAPHY ; HOLOGRAPHY ; MATERIALS THEREFOR ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; SEMICONDUCTOR DEVICES</subject><creationdate>2005</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20050929&amp;DB=EPODOC&amp;CC=JP&amp;NR=2005268781A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25569,76552</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20050929&amp;DB=EPODOC&amp;CC=JP&amp;NR=2005268781A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SCHARNWEBER RALF</creatorcontrib><title>MULTIPLE EXPOSURE METHOD, MICROLITHOGRAPHIC PROJECTION ALIGNER, AND PROJECTION SYSTEM</title><description>PROBLEM TO BE SOLVED: To provide a multiple exposure method achieving a large throughput of wafer processing, and a microlithographic projection aligner which improves the productivity, at least with unchanging quality and low cost. SOLUTION: In the multiple exposure method for at least one substrate covered with a photosensitive layer, first exposure is performed in a first projection system (17) according to an exposure parameter of a first group, and second exposure is performed in a second projection system (18) spatially separated from the first projection system (17). These projection systems are integrated with a common projection aligner (1). For example, the first exposure is performed using an amplitude mask (6), and the second exposure is performed using a phase mask (9). The first exposure and the second exposure are performed in parallel, by using a number of projection systems, thereby achieving multiple exposures which save time. COPYRIGHT: (C)2005,JPO&amp;NCIPI</description><subject>ACCESSORIES THEREFOR</subject><subject>APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USINGWAVES OTHER THAN OPTICAL WAVES</subject><subject>APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FORPROJECTING OR VIEWING THEM</subject><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CINEMATOGRAPHY</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MATERIALS THEREFOR</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2005</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZAj1DfUJ8QzwcVVwjQjwDw4NclXwdQ3x8HfRUfD1dA7y9_EEctyDHAM8PJ0VAoL8vVydQzz9_RQcfTzd_VyDdBQc_VyQxYMjg0NcfXkYWNMSc4pTeaE0N4OSm2uIs4duakF-fGpxQWJyal5qSbxXgJGBgamRmYW5haGjMVGKAAlnMWo</recordid><startdate>20050929</startdate><enddate>20050929</enddate><creator>SCHARNWEBER RALF</creator><scope>EVB</scope></search><sort><creationdate>20050929</creationdate><title>MULTIPLE EXPOSURE METHOD, MICROLITHOGRAPHIC PROJECTION ALIGNER, AND PROJECTION SYSTEM</title><author>SCHARNWEBER RALF</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2005268781A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2005</creationdate><topic>ACCESSORIES THEREFOR</topic><topic>APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USINGWAVES OTHER THAN OPTICAL WAVES</topic><topic>APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FORPROJECTING OR VIEWING THEM</topic><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CINEMATOGRAPHY</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>MATERIALS THEREFOR</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>SCHARNWEBER RALF</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SCHARNWEBER RALF</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>MULTIPLE EXPOSURE METHOD, MICROLITHOGRAPHIC PROJECTION ALIGNER, AND PROJECTION SYSTEM</title><date>2005-09-29</date><risdate>2005</risdate><abstract>PROBLEM TO BE SOLVED: To provide a multiple exposure method achieving a large throughput of wafer processing, and a microlithographic projection aligner which improves the productivity, at least with unchanging quality and low cost. SOLUTION: In the multiple exposure method for at least one substrate covered with a photosensitive layer, first exposure is performed in a first projection system (17) according to an exposure parameter of a first group, and second exposure is performed in a second projection system (18) spatially separated from the first projection system (17). These projection systems are integrated with a common projection aligner (1). For example, the first exposure is performed using an amplitude mask (6), and the second exposure is performed using a phase mask (9). The first exposure and the second exposure are performed in parallel, by using a number of projection systems, thereby achieving multiple exposures which save time. COPYRIGHT: (C)2005,JPO&amp;NCIPI</abstract><edition>7</edition><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_JP2005268781A
source esp@cenet
subjects ACCESSORIES THEREFOR
APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USINGWAVES OTHER THAN OPTICAL WAVES
APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FORPROJECTING OR VIEWING THEM
APPARATUS SPECIALLY ADAPTED THEREFOR
BASIC ELECTRIC ELEMENTS
CINEMATOGRAPHY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
SEMICONDUCTOR DEVICES
title MULTIPLE EXPOSURE METHOD, MICROLITHOGRAPHIC PROJECTION ALIGNER, AND PROJECTION SYSTEM
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-14T17%3A55%3A19IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=SCHARNWEBER%20RALF&rft.date=2005-09-29&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2005268781A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true