HIGH FREQUENCY MODULE

HIGH FREQUENCY MODULE

PROBLEM TO BE SOLVED: To reduce radiant quantity of unwanted radiation to exterior by taking measures against unwanted radiation independent of selection of conductive material or construction of a conductive layer in a high frequency module. SOLUTION: The high frequency module has a substrate 3 in...

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1. Verfasser: YASOOKA KOSUKE
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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creator YASOOKA KOSUKE
description PROBLEM TO BE SOLVED: To reduce radiant quantity of unwanted radiation to exterior by taking measures against unwanted radiation independent of selection of conductive material or construction of a conductive layer in a high frequency module. SOLUTION: The high frequency module has a substrate 3 in a space which is formed between a base plate 2 and a conductor cover 1. In the module, a gap between an endless conductive elastomer 4a and a conductive elastomer 4b interposed at predetermined positions of a gap between the conductor cover 1 and the base plate 2, is set to be about quarter of wavelength. COPYRIGHT: (C)2005,JPO&NCIPI
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subjects BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
title HIGH FREQUENCY MODULE
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