THERMAL HEAD AND THERMAL PRINTER HAVING THE SAME

PROBLEM TO BE SOLVED: To provide a high performance thermal head capable of being miniaturized and a thermal printer. SOLUTION: This thermal head comprises a head substrate 1 having a plurality of heating elements 2 and a circuit conductor 3 electrically connected to the heating elements 2, and a fl...

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1. Verfasser: SHINTANI SHIGETAKA
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a high performance thermal head capable of being miniaturized and a thermal printer. SOLUTION: This thermal head comprises a head substrate 1 having a plurality of heating elements 2 and a circuit conductor 3 electrically connected to the heating elements 2, and a flexible wiring board 4 having a plurality of wiring conductors 5, the one end side of the flexible wiring board 4 being provided along the edge of the head substrate 1. In the thermal head, the wiring conductors 5 are electrically connected to the circuit conductor 3 at one end side of the flexible wiring board 4. The flexible wiring board 4 has a protruding section 13 positioned on a portion at the outside of the head substrate 1 in a direction along the edge of the head substrate 1 and the protruding section 13 is folded to the upper or lower face side of the flexible wiring board 4. COPYRIGHT: (C)2005,JPO&NCIPI