Sn-Zn BASED SOLDER ALLOY

PROBLEM TO BE SOLVED: To provide an Sn-Zn based solder alloy in which the formation of intermetallic compounds at the time of soldering is suppressed, and further, the growth of intermetallic compounds after soldering can be suppressed as well. SOLUTION: The Sn-Zn based solder alloy comprises, by we...

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Bibliographische Detailangaben
Hauptverfasser:	MATSUBARA EIICHIRO, ICHITSUBO SATORU, ANADA TAKAAKI, KUMAMOTO SATOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	ALLOYS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING FERROUS OR NON-FERROUS ALLOYS MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an Sn-Zn based solder alloy in which the formation of intermetallic compounds at the time of soldering is suppressed, and further, the growth of intermetallic compounds after soldering can be suppressed as well. SOLUTION: The Sn-Zn based solder alloy comprises, by weight, 3 to 12% Zn and 3.1 to 7% Cu, and the balance Sn with inevitable impurities. Alternatively, the Sn-Zn based solder alloy comprises 3 to 12% Zn and 1.5 to 7% Ni, and the balance Sn with inevitable impurities. Alternatively, the Sn-Zn based solder alloy comprises 3 to 12% Zn, and Cu and Ni by 1 to 7% in total, and the balance Sn with inevitable impurities. COPYRIGHT: (C)2005,JPO&NCIPI