MANUFACTURING METHOD FOR GROUP-III NITRIDE COMPOUND SEMICONDUCTOR LED
PROBLEM TO BE SOLVED: To provide a Group-III nitride compound semiconductor LED, capable of separating the end surface from the device and of forming the electrodes of a Group-III nitride compound semiconductor thin film of the Group-III nitride compound semiconductor LED, without having to use etch...
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creator | INOGUCHI KAZUHIKO |
description | PROBLEM TO BE SOLVED: To provide a Group-III nitride compound semiconductor LED, capable of separating the end surface from the device and of forming the electrodes of a Group-III nitride compound semiconductor thin film of the Group-III nitride compound semiconductor LED, without having to use etching technology. SOLUTION: The manufacturing method for the Group-III nitride compound semiconductor LED comprises a production process of forming a dielectric film on a substrate or Group-III nitride compound semiconductor into a pattern shape; and production process of performing selective growth of the Group-III nitride compound semiconductor thin film, which is the multilayer film of a Group-III nitride compound semiconductor layer on a substrate or the Group-III nitride compound semiconductor, in a way such that the film is thicker than that of the dielectric film; the Group-III nitride compound semiconductor thin film grows wider than the region of the film thickness of the dielectric film; and the end surface having slanting angles at its both ends is formed. COPYRIGHT: (C)2005,JPO&NCIPI |
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fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2005229132A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2005229132A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2005229132A3</originalsourceid><addsrcrecordid>eNqNyrEKwjAQANAsDqL-w-FeqCkOjuFyaU9MLsRkLkXiJFqo_48OfoDTW95akTehOIO5JA49eMqDWHCSoE9SYsPMEDgntgQoPkoJFq7kGSXYgvkbL2S3anWfHkvd_dyovaOMQ1Pn11iXebrVZ32P56jb9qj16dBp0_2VPvnPLK0</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>MANUFACTURING METHOD FOR GROUP-III NITRIDE COMPOUND SEMICONDUCTOR LED</title><source>esp@cenet</source><creator>INOGUCHI KAZUHIKO</creator><creatorcontrib>INOGUCHI KAZUHIKO</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a Group-III nitride compound semiconductor LED, capable of separating the end surface from the device and of forming the electrodes of a Group-III nitride compound semiconductor thin film of the Group-III nitride compound semiconductor LED, without having to use etching technology. SOLUTION: The manufacturing method for the Group-III nitride compound semiconductor LED comprises a production process of forming a dielectric film on a substrate or Group-III nitride compound semiconductor into a pattern shape; and production process of performing selective growth of the Group-III nitride compound semiconductor thin film, which is the multilayer film of a Group-III nitride compound semiconductor layer on a substrate or the Group-III nitride compound semiconductor, in a way such that the film is thicker than that of the dielectric film; the Group-III nitride compound semiconductor thin film grows wider than the region of the film thickness of the dielectric film; and the end surface having slanting angles at its both ends is formed. COPYRIGHT: (C)2005,JPO&NCIPI</description><edition>7</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; DEVICES USING STIMULATED EMISSION ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2005</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20050825&DB=EPODOC&CC=JP&NR=2005229132A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20050825&DB=EPODOC&CC=JP&NR=2005229132A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>INOGUCHI KAZUHIKO</creatorcontrib><title>MANUFACTURING METHOD FOR GROUP-III NITRIDE COMPOUND SEMICONDUCTOR LED</title><description>PROBLEM TO BE SOLVED: To provide a Group-III nitride compound semiconductor LED, capable of separating the end surface from the device and of forming the electrodes of a Group-III nitride compound semiconductor thin film of the Group-III nitride compound semiconductor LED, without having to use etching technology. SOLUTION: The manufacturing method for the Group-III nitride compound semiconductor LED comprises a production process of forming a dielectric film on a substrate or Group-III nitride compound semiconductor into a pattern shape; and production process of performing selective growth of the Group-III nitride compound semiconductor thin film, which is the multilayer film of a Group-III nitride compound semiconductor layer on a substrate or the Group-III nitride compound semiconductor, in a way such that the film is thicker than that of the dielectric film; the Group-III nitride compound semiconductor thin film grows wider than the region of the film thickness of the dielectric film; and the end surface having slanting angles at its both ends is formed. COPYRIGHT: (C)2005,JPO&NCIPI</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>DEVICES USING STIMULATED EMISSION</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2005</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyrEKwjAQANAsDqL-w-FeqCkOjuFyaU9MLsRkLkXiJFqo_48OfoDTW95akTehOIO5JA49eMqDWHCSoE9SYsPMEDgntgQoPkoJFq7kGSXYgvkbL2S3anWfHkvd_dyovaOMQ1Pn11iXebrVZ32P56jb9qj16dBp0_2VPvnPLK0</recordid><startdate>20050825</startdate><enddate>20050825</enddate><creator>INOGUCHI KAZUHIKO</creator><scope>EVB</scope></search><sort><creationdate>20050825</creationdate><title>MANUFACTURING METHOD FOR GROUP-III NITRIDE COMPOUND SEMICONDUCTOR LED</title><author>INOGUCHI KAZUHIKO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2005229132A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2005</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>DEVICES USING STIMULATED EMISSION</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>INOGUCHI KAZUHIKO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>INOGUCHI KAZUHIKO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>MANUFACTURING METHOD FOR GROUP-III NITRIDE COMPOUND SEMICONDUCTOR LED</title><date>2005-08-25</date><risdate>2005</risdate><abstract>PROBLEM TO BE SOLVED: To provide a Group-III nitride compound semiconductor LED, capable of separating the end surface from the device and of forming the electrodes of a Group-III nitride compound semiconductor thin film of the Group-III nitride compound semiconductor LED, without having to use etching technology. SOLUTION: The manufacturing method for the Group-III nitride compound semiconductor LED comprises a production process of forming a dielectric film on a substrate or Group-III nitride compound semiconductor into a pattern shape; and production process of performing selective growth of the Group-III nitride compound semiconductor thin film, which is the multilayer film of a Group-III nitride compound semiconductor layer on a substrate or the Group-III nitride compound semiconductor, in a way such that the film is thicker than that of the dielectric film; the Group-III nitride compound semiconductor thin film grows wider than the region of the film thickness of the dielectric film; and the end surface having slanting angles at its both ends is formed. COPYRIGHT: (C)2005,JPO&NCIPI</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS DEVICES USING STIMULATED EMISSION ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
title | MANUFACTURING METHOD FOR GROUP-III NITRIDE COMPOUND SEMICONDUCTOR LED |
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