SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To realize miniaturization, regarding a semiconductor device referred to as SIP (System In Package). SOLUTION: The semiconductor device is provided with a package substrate 5; a microcomputer chip 1 which is arranged on the core layer 5c of the package substrate 5 and equipped...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	NAKAMURA ATSUSHI, SUWA MOTOHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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