METHOD AND APPARATUS FOR SUBSTRATE TREATMENT

PROBLEM TO BE SOLVED: To provide a substrate treatment method and apparatus which can make treatments easily and can form a thin oxide film evenly on a clean substrate surface. SOLUTION: In wash-treatment sections 5a-5d, high-density ozone water is supplied onto the surface of a substrate W being he...

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Hauptverfasser: HAYASHI TOKUYUKI, NAGANORI ATSUO
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a substrate treatment method and apparatus which can make treatments easily and can form a thin oxide film evenly on a clean substrate surface. SOLUTION: In wash-treatment sections 5a-5d, high-density ozone water is supplied onto the surface of a substrate W being held and rotated by a spin chuck 21 from a nozzle 50 for oxidation treatment. Then, hydrogen fluoride water is supplied onto the surface of the substrate W which has been supplied with the high-density ozone water from a nozzle 70 for etching. It is preferred that the high-density ozone water and the hydrogen fluoride water are supplied to the substrate W several times, say, twice or three times, etc. Thereafter, low-density ozone water is supplied onto the surface of the substrate W from the nozzle 50 for oxidation treatment. COPYRIGHT: (C)2005,JPO&NCIPI