THERMALLY CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE COMPOSITION, THERMALLY CONDUCTIVE SHEET-LIKE MOLDED BODY, AND ITS MANUFACTURING METHOD
PROBLEM TO BE SOLVED: To provide a thermally conductive pressure-sensitive adhesive composition having sufficient pressure-sensitive adhesiveness, excellent particularly in the balance between hardness and pressure-sensitive adhesiveness, having sufficient thermal conductivity, and capable of formin...
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| creator | IWABUCHI SATOSHI MIKUNI TAKAMITSU |
| description | PROBLEM TO BE SOLVED: To provide a thermally conductive pressure-sensitive adhesive composition having sufficient pressure-sensitive adhesiveness, excellent particularly in the balance between hardness and pressure-sensitive adhesiveness, having sufficient thermal conductivity, and capable of forming a sheet high in sheet smoothness, and to provide a thermally conductive sheet-like molded body comprising the above composition and its manufacturing method. SOLUTION: The thermally conductive pressure-sensitive adhesive composition comprises, based on 100 mass pts. of a (meth)acrylate copolymer (A), 0.1-5 mass pts. of silica (B) whose primary particle has a mean particle diameter of 5-20 nm and whose hydrophobicity ratio by the transmittance method is ≤50%, and 50-300 mass pts. of a thermally conductive inorganic compound (C) other than the silica (B). The thermally conductive sheet-like molded body comprises this thermally conductive pressure-sensitive adhesive composition. COPYRIGHT: (C)2005,JPO&NCIPI |
| format | Patent |
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SOLUTION: The thermally conductive pressure-sensitive adhesive composition comprises, based on 100 mass pts. of a (meth)acrylate copolymer (A), 0.1-5 mass pts. of silica (B) whose primary particle has a mean particle diameter of 5-20 nm and whose hydrophobicity ratio by the transmittance method is ≤50%, and 50-300 mass pts. of a thermally conductive inorganic compound (C) other than the silica (B). The thermally conductive sheet-like molded body comprises this thermally conductive pressure-sensitive adhesive composition. 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SOLUTION: The thermally conductive pressure-sensitive adhesive composition comprises, based on 100 mass pts. of a (meth)acrylate copolymer (A), 0.1-5 mass pts. of silica (B) whose primary particle has a mean particle diameter of 5-20 nm and whose hydrophobicity ratio by the transmittance method is ≤50%, and 50-300 mass pts. of a thermally conductive inorganic compound (C) other than the silica (B). The thermally conductive sheet-like molded body comprises this thermally conductive pressure-sensitive adhesive composition. 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SOLUTION: The thermally conductive pressure-sensitive adhesive composition comprises, based on 100 mass pts. of a (meth)acrylate copolymer (A), 0.1-5 mass pts. of silica (B) whose primary particle has a mean particle diameter of 5-20 nm and whose hydrophobicity ratio by the transmittance method is ≤50%, and 50-300 mass pts. of a thermally conductive inorganic compound (C) other than the silica (B). The thermally conductive sheet-like molded body comprises this thermally conductive pressure-sensitive adhesive composition. COPYRIGHT: (C)2005,JPO&NCIPI</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES |
| title | THERMALLY CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE COMPOSITION, THERMALLY CONDUCTIVE SHEET-LIKE MOLDED BODY, AND ITS MANUFACTURING METHOD |
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