MAGNETIC MEMORY CELL, ITS FORMING METHOD, MAGNETIC MEMORY ARRAY, AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a method of forming magnetic memory cells, in which magnetic influence from the ambience is reduced, and magnetic information can be read stably. SOLUTION: The method includes a stage of forming a MTJ element 20A comprising a magnetization free layer 25 covered with...

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Hauptverfasser: HONG LIUBO, HAN CHERNGYI
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creator HONG LIUBO
HAN CHERNGYI
description PROBLEM TO BE SOLVED: To provide a method of forming magnetic memory cells, in which magnetic influence from the ambience is reduced, and magnetic information can be read stably. SOLUTION: The method includes a stage of forming a MTJ element 20A comprising a magnetization free layer 25 covered with a cap layer 30 and a protective layer 50 on an electrode layer 10, a stage of forming a first insulating layer 41 so as to cover the whole, a stage of performing flattening treatment over the entire surface so that one portion (residual portion 52) in a thickness direction of the protective layer 50 is left, a stage of removing the residual portion 52 entirely so that the upper surface of the cap layer 30 may be exposed, a step of forming a bit line 60 so that the upper surface 30S of the cap layer 30 may be covered, and a step of filling the periphery of the bit line 60, and forming a second insulating layer 42 so that a flat surface F1 contiguous to the upper surface of the bit line 60 may be constituted. Therefore, the distance of the thickness direction of the magnetization free layer 25 and a first current line 60 can be uniform and precise over the whole based on the thickness of the cap layer 30. COPYRIGHT: (C)2005,JPO&NCIPI
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SOLUTION: The method includes a stage of forming a MTJ element 20A comprising a magnetization free layer 25 covered with a cap layer 30 and a protective layer 50 on an electrode layer 10, a stage of forming a first insulating layer 41 so as to cover the whole, a stage of performing flattening treatment over the entire surface so that one portion (residual portion 52) in a thickness direction of the protective layer 50 is left, a stage of removing the residual portion 52 entirely so that the upper surface of the cap layer 30 may be exposed, a step of forming a bit line 60 so that the upper surface 30S of the cap layer 30 may be covered, and a step of filling the periphery of the bit line 60, and forming a second insulating layer 42 so that a flat surface F1 contiguous to the upper surface of the bit line 60 may be constituted. 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SOLUTION: The method includes a stage of forming a MTJ element 20A comprising a magnetization free layer 25 covered with a cap layer 30 and a protective layer 50 on an electrode layer 10, a stage of forming a first insulating layer 41 so as to cover the whole, a stage of performing flattening treatment over the entire surface so that one portion (residual portion 52) in a thickness direction of the protective layer 50 is left, a stage of removing the residual portion 52 entirely so that the upper surface of the cap layer 30 may be exposed, a step of forming a bit line 60 so that the upper surface 30S of the cap layer 30 may be covered, and a step of filling the periphery of the bit line 60, and forming a second insulating layer 42 so that a flat surface F1 contiguous to the upper surface of the bit line 60 may be constituted. 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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INDUCTANCES
INFORMATION STORAGE
MAGNETS
PHYSICS
SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
SEMICONDUCTOR DEVICES
STATIC STORES
TRANSFORMERS
title MAGNETIC MEMORY CELL, ITS FORMING METHOD, MAGNETIC MEMORY ARRAY, AND ITS MANUFACTURING METHOD
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