FLIP CHIP JOINING METHOD WHOSE BONDING CAPACITY IN FLIP CHIP PACKAGING PROCESS IMPROVES, AND METAL LAMINATE STRUCTURE OF SUBSTRATE FOR IT

PROBLEM TO BE SOLVED: To provide a flip chip packaging method for improving bonding performance by forming a vamp on a pad of a chip or a substrate, and a laminate structure of the substrate thereof. SOLUTION: A method of bonding the chip having a bonding pad on the substrate which comprises the steps of: obtaining an individual chip pretreated by dicing a chip of a wafer state; pretreating the substrate; bonding the chip and the substrate by pressure bonding while applying ultrasonic wave and heat after aligning pad side of the above-mentioned chip with pad side of the above-mentioned substrate; and posttreating the bonding by filling resin or molding. The vamp of the chip or the substrate is formed by plating, forming stud or wedge vamp, or by forming the stud or the wedge vamp on the plated vamp. The vamp can be formed using Au, Ni, Ag, Cu or the like, and vamp size of the substrate can be identical to that of the chip, further, either of them can be enlarged more than the other, and the substrate is plated by Au, Ag, Cu, and Sn. COPYRIGHT: (C)2005,JPO&NCIPI