METHOD OF PRODUCING FINE WIRING

PROBLEM TO BE SOLVED: To provide a technique capable of flattening the upper faces of a via land pad and/or circuit wiring for obtaining fine wiring in which via land pad size is reduced, and wiring groove width is made narrower. SOLUTION: In the method of producing a fine wiring circuit where, by semiadditive method, copper is filled into a via land pad part and/or a wiring circuit part molded with a plating resist by acid copper electroplating to form a wiring circuit, and the wiring circuit layers are plurally superimposed, under the acid copper electroplating or after the acid copper electroplating, electric current opposite to the one at the time of the acid copper electroplating is applied, and a part of the precipitated copper is dissolved. COPYRIGHT: (C)2005,JPO&NCIPI