POLYIMIDE METAL LAMINATED PLATE

PROBLEM TO BE SOLVED: To provide a polyimide metal laminated plate in which a wiring dislocation and an edge short circuit after the mounting of chips, and faults such as the sinking of metal wiring in a polyimide layer and the peeling of the wiring from the polyimide layer are prevented. SOLUTION:...

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Bibliographische Detailangaben
Hauptverfasser:	KAWAGUCHI MASAO, OTSUBO EIJI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a polyimide metal laminated plate in which a wiring dislocation and an edge short circuit after the mounting of chips, and faults such as the sinking of metal wiring in a polyimide layer and the peeling of the wiring from the polyimide layer are prevented. SOLUTION: The polyimide metal laminated plate is composed of the polyimide layers and a metal layer. In the laminated plate, at least one polyimide (PI) layer having a modulus of elasticity in a temperature area of at least 350°C of 1-30 GPa exists in the polyimide layers. COPYRIGHT: (C)2005,JPO&NCIPI