METHOD OF MANUFACTURING ELECTRONIC COMPONENT, AND COATING AGENT FOR ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic component, in which the adherence of soldering dregs is fully prevented on the side of the component package, which needs to be prevented from being soldered. SOLUTION: A plastic package 14 or only a part of the plastic packag...

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Bibliographische Detailangaben
Hauptverfasser:	HOEHN KLAUS, WAITL GUENTER
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic component, in which the adherence of soldering dregs is fully prevented on the side of the component package, which needs to be prevented from being soldered. SOLUTION: A plastic package 14 or only a part of the plastic package having at least one metal soldering region 4 of the electronic component 1, is coated by a solder adhesion preventing layer 6, which mainly has siloxane, and is fixed on the plastic package 14 in the form of a solution without another solvent additive. COPYRIGHT: (C)2005,JPO&NCIPI