ELECTROPLATED INTERCONNECTION STRUCTURE ON INTEGRATED CIRCUIT CHIP

PROBLEM TO BE SOLVED: To provide a method of manufacturing a submicron interconnection structure for an integrated circuit. SOLUTION: By electroplating Cu in a bath which includes an additive and is usually used for adhering Cu metal which is flat and glossy and has high ductility and low stress, se...

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Bibliographische Detailangaben

Hauptverfasser:	HU CHAO-KUN, HURD JEFFREY LOUIS, ANDRICACOS PANAYOTIS CONSTANTINOU, DELIGIANNI HARIKLIA, RODBELL KENNETH PARKER, DUKOVIC JOHN OWEN, HORKANS WILMA J, WONG KWONG-HON, EDELSTEIN DANIEL CHARLES, UZOH CYPRIAN EMEKA
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SEMICONDUCTOR DEVICES
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