COMPOSITION FOR FORMING DIELECTRIC FILM AND METHOD FOR FORMING DIELECTRIC FILM OR DIELECTRIC FILM PATTERN USING THE SAME
PROBLEM TO BE SOLVED: To provide a composition for forming a porous dielectric film and a method for forming a porous dielectric film or its pattern using the same. SOLUTION: The composition for forming a dielectric film is prepared by dispersing, in an organic solvent, a siloxane-based resin precur...
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| creator | SEON JONG BAEK RYU RIRETSU YIM JIN HEONG |
| description | PROBLEM TO BE SOLVED: To provide a composition for forming a porous dielectric film and a method for forming a porous dielectric film or its pattern using the same. SOLUTION: The composition for forming a dielectric film is prepared by dispersing, in an organic solvent, a siloxane-based resin precursor having hydroxyl groups or alkoxy groups, a condensation catalyst generator which generates an acid or base catalyst capable of curing the siloxane-based resin precursor in exposure, and a pore-generating material. A porous dielectric film having a lowered dielectric constant and improved physical properties of a thin film is obtained by forming a thin film on a substrate using the composition, exposing it and causing polycondensation at low temperature. When exposure is carried out through a patterned mask and unexposed regions are removed by development, a negative pattern of a porous dielectric film can be formed without using a photoresist. COPYRIGHT: (C)2005,JPO&NCIPI |
| format | Patent |
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SOLUTION: The composition for forming a dielectric film is prepared by dispersing, in an organic solvent, a siloxane-based resin precursor having hydroxyl groups or alkoxy groups, a condensation catalyst generator which generates an acid or base catalyst capable of curing the siloxane-based resin precursor in exposure, and a pore-generating material. A porous dielectric film having a lowered dielectric constant and improved physical properties of a thin film is obtained by forming a thin film on a substrate using the composition, exposing it and causing polycondensation at low temperature. When exposure is carried out through a patterned mask and unexposed regions are removed by development, a negative pattern of a porous dielectric film can be formed without using a photoresist. COPYRIGHT: (C)2005,JPO&NCIPI</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVES APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CHEMICAL PAINT OR INK REMOVERS CHEMISTRY CINEMATOGRAPHY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CORRECTING FLUIDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY FILLING PASTES HOLOGRAPHY INKS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MATERIALS THEREFOR METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS THEREFOR WOODSTAINS |
| title | COMPOSITION FOR FORMING DIELECTRIC FILM AND METHOD FOR FORMING DIELECTRIC FILM OR DIELECTRIC FILM PATTERN USING THE SAME |
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