MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a manufacturing method for a laminated semiconductor device capable of preventing the insufficient filling and excess protrusion of a thermosetting-resin sheet, when even the insulating thermosetting-resin sheet interposed between a semiconductor carrier and a semico...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	AKABOSHI TOSHITAKA, TAKEMURA YASUSHI, TAKEOKA YOSHIAKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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