MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a manufacturing method for a laminated semiconductor device capable of preventing the insufficient filling and excess protrusion of a thermosetting-resin sheet, when even the insulating thermosetting-resin sheet interposed between a semiconductor carrier and a semiconductor element is deformed and sealed with a resin, in a heating pressure process in which the semiconductor element is flip-chip mounted on the semiconductor carrier. SOLUTION: The first semiconductor element 8 is flip-chip mounted on the semiconductor carrier 4 by using the thermosetting-resin sheet 5 in which a central section is pressured and deformed in a recessed shape, regarding the manufacturing method for the semiconductor device in which a plurality of the semiconductor elements are laminated. It means that the quantities of a resin at the central sections of sides with a lot of the quantities of the protrusions are collected previously at corners with less quantities of the resin. The quantities of the protrusion up to the outside can be made smaller than the first semiconductor element 8, surely filling sections up to the corners of the first semiconductor element 8 with the resin in the case of a heating pressure. Accordingly, the miniaturized semiconductor device with improved reliability can be obtained stably and easily. COPYRIGHT: (C)2005,JPO&NCIPI