ALIGNER AND ITS ADJUSTMENT METHOD, EXPOSURE METHOD, AND DEVICE MANUFACTURING METHOD
PROBLEM TO BE SOLVED: To provide an aligner which easily confirms a movement error of a shutting component used to shut the unnecessary exposure light when transferring a pattern formed on a mask on a substrate, synchronously moving the mask and the substrate, and which can adjust the movement. SOLU...
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| creator | NISHINAGA HISASHI |
| description | PROBLEM TO BE SOLVED: To provide an aligner which easily confirms a movement error of a shutting component used to shut the unnecessary exposure light when transferring a pattern formed on a mask on a substrate, synchronously moving the mask and the substrate, and which can adjust the movement. SOLUTION: An illumination sensor, which detects exposure light IL through a pin hole 41, is mounted on a wafer stage. In a state where an image of an edge 15a of a moving blind 15 as a shutting component is formed on the pin hole 41 of the illumination sensor, the moving blind 15 and wafer stage are moved, and the movement error of the moving blind 15 is measured on the basis of an output variation of the illumination sensor. COPYRIGHT: (C)2005,JPO&NCIPI |
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SOLUTION: An illumination sensor, which detects exposure light IL through a pin hole 41, is mounted on a wafer stage. In a state where an image of an edge 15a of a moving blind 15 as a shutting component is formed on the pin hole 41 of the illumination sensor, the moving blind 15 and wafer stage are moved, and the movement error of the moving blind 15 is measured on the basis of an output variation of the illumination sensor. 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| subjects | APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES |
| title | ALIGNER AND ITS ADJUSTMENT METHOD, EXPOSURE METHOD, AND DEVICE MANUFACTURING METHOD |
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