MARK DETECTING METHOD IN CIRCULAR BODY, NOTCH DETECTING METHOD, DIRECTION INSPECTION METHOD FOR SEMICONDUCTOR WAFER AND DIRECTION INSPECTION DEVICE FOR SEMICONDUCTOR WAFER

PROBLEM TO BE SOLVED: To accurately detect a fine mark formed on the peripheral section of a circular body. SOLUTION: Edge extraction processing is carried out to an image obtained by image-picking up a wafer, and the center point O1 of the wafer is extracted on an obtained edge image. An annular wi...

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Bibliographische Detailangaben

1. Verfasser:	NISHIGUCHI OSAMU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS PHYSICS SEMICONDUCTOR DEVICES TESTING
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