ELECTROCONDUCTIVE ADHESIVE
PROBLEM TO BE SOLVED: To provide an electroconductive adhesive having volume electroconductivity and adhesive force improved by improving the dispersibility of a compound having migration-inhibiting activities of an electroconductive filler and reducing the amount of the added compound, also having...
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creator | YANAI MASAHIRO |
description | PROBLEM TO BE SOLVED: To provide an electroconductive adhesive having volume electroconductivity and adhesive force improved by improving the dispersibility of a compound having migration-inhibiting activities of an electroconductive filler and reducing the amount of the added compound, also having migration-inhibiting effects, singly imparting flexibility to a cured product, and having both of improved adhesion and reworkability. SOLUTION: The electroconductive adhesive comprises a thermosetting compound and an electroconductive filler. The thermosetting compound contains at least a hydrazide compound. The electroconductive adhesive can contain a thermoplastic resin. COPYRIGHT: (C)2005,JPO&NCIPI |
format | Patent |
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SOLUTION: The electroconductive adhesive comprises a thermosetting compound and an electroconductive filler. The thermosetting compound contains at least a hydrazide compound. The electroconductive adhesive can contain a thermoplastic resin. COPYRIGHT: (C)2005,JPO&NCIPI</description><edition>7</edition><language>eng</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CABLES ; CHEMISTRY ; CONDUCTORS ; DYES ; ELECTRICITY ; INSULATORS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; PAINTS ; POLISHES ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2005</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20050407&DB=EPODOC&CC=JP&NR=2005089629A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20050407&DB=EPODOC&CC=JP&NR=2005089629A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YANAI MASAHIRO</creatorcontrib><title>ELECTROCONDUCTIVE ADHESIVE</title><description>PROBLEM TO BE SOLVED: To provide an electroconductive adhesive having volume electroconductivity and adhesive force improved by improving the dispersibility of a compound having migration-inhibiting activities of an electroconductive filler and reducing the amount of the added compound, also having migration-inhibiting effects, singly imparting flexibility to a cured product, and having both of improved adhesion and reworkability. SOLUTION: The electroconductive adhesive comprises a thermosetting compound and an electroconductive filler. The thermosetting compound contains at least a hydrazide compound. The electroconductive adhesive can contain a thermoplastic resin. 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SOLUTION: The electroconductive adhesive comprises a thermosetting compound and an electroconductive filler. The thermosetting compound contains at least a hydrazide compound. The electroconductive adhesive can contain a thermoplastic resin. COPYRIGHT: (C)2005,JPO&NCIPI</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CHEMISTRY CONDUCTORS DYES ELECTRICITY INSULATORS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES USE OF MATERIALS AS ADHESIVES |
title | ELECTROCONDUCTIVE ADHESIVE |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-23T17%3A31%3A31IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=YANAI%20MASAHIRO&rft.date=2005-04-07&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2005089629A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |