ELECTROCONDUCTIVE ADHESIVE

PROBLEM TO BE SOLVED: To provide an electroconductive adhesive having volume electroconductivity and adhesive force improved by improving the dispersibility of a compound having migration-inhibiting activities of an electroconductive filler and reducing the amount of the added compound, also having...

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Bibliographische Detailangaben
1. Verfasser:	YANAI MASAHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CHEMISTRY CONDUCTORS DYES ELECTRICITY INSULATORS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an electroconductive adhesive having volume electroconductivity and adhesive force improved by improving the dispersibility of a compound having migration-inhibiting activities of an electroconductive filler and reducing the amount of the added compound, also having migration-inhibiting effects, singly imparting flexibility to a cured product, and having both of improved adhesion and reworkability. SOLUTION: The electroconductive adhesive comprises a thermosetting compound and an electroconductive filler. The thermosetting compound contains at least a hydrazide compound. The electroconductive adhesive can contain a thermoplastic resin. COPYRIGHT: (C)2005,JPO&NCIPI