LAMINATED WIRING BOARD AND ITS MANUFACTURING METHOD, AND ELECTRIC DEVICE AND ITS MOUNTING STRUCTURE

PROBLEM TO BE SOLVED: To provide a laminated wiring board wherein high reliability can be obtained even if it is provided between an electric device with a small thermal expansion coefficient of Si or the like and an external circuit board with a large thermal expansion coefficient of a printed circ...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KOKUBU MASAYA, KAWAI SHINYA, FURUKUBO YOJI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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