LAMINATED WIRING BOARD AND ITS MANUFACTURING METHOD, AND ELECTRIC DEVICE AND ITS MOUNTING STRUCTURE

PROBLEM TO BE SOLVED: To provide a laminated wiring board wherein high reliability can be obtained even if it is provided between an electric device with a small thermal expansion coefficient of Si or the like and an external circuit board with a large thermal expansion coefficient of a printed circuit board or the like, and provide an electric device using the laminated wiring board and its mounting structure. SOLUTION: In the laminated wiring board A wherein a first wiring board 1 and a second wiring board 2 are connected with each other through a connection electrode 5, a thermal expansion coefficient of the second wiring board 2 at 0-150°C is larger than that of the first wiring board 1 at 0-150°C, and the second wiring board 2 contains a silicate of an alkali metal or a silicate of an alkaline earth metal or at least one of the silicates of both alkali metal and alkaline earth metal as a crystal phase in a second insulating substrate 2b forming the board 2. Its thermal expansion coefficient is 7-14×10-6/°C. COPYRIGHT: (C)2005,JPO&NCIPI