PRINTED WIRING BOARD AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed wiring board with high efficiency and high accuracy without causing defect on products and production even on a high-density printed wiring board, and to provide the printed wiring board. SOLUTION: The printed wiring board 14 is equipped with conductor patterns 13 formed on the surface of an insulating substrate 1 a bonding pad 13a of the conductor patterns 13 and nickel/gold plating layers 12 in a ball pad part 13b. All wiring parts extending from the sides of the pads 13a and 13b of the conductor patterns 13 along the surface of the insulating substrate 1 are all electrically connected to the conductor patterns 13 except the pads 13a and 13b. COPYRIGHT: (C)2005,JPO&NCIPI