LAMINATED WIRING BOARD, ELECTRIC APPARATUS, AND ITS MOUNTING STRUCTURE

PROBLEM TO BE SOLVED: To provide a laminated wiring board that can obtain high mounting reliability even when the wiring board is interposed between an electric element composed of Si etc., having a small coefficient of thermal expansion and an external circuit board, such as the printed board etc.,...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KOKUBU MASAYA, KAWAI SHINYA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!