SEMICONDUCTOR ELEMENT AND METHOD OF MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a semiconductor element where metallic resistance is suitably formed and a contact hole where contact wiring is provided is formed to be narrow. SOLUTION: The semiconductor element 1 is provided with an HBT 3 and insulation layers 11 and 13. In the semiconductor elem...

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Bibliographische Detailangaben
1. Verfasser: KOTANI KENJI
Format: Patent
Sprache:eng
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