REFLOW SOLDERING METHOD EMPLOYING Pb-FREE SOLDER ALLOY, REFLOW SOLDERING METHOD, MIXED MOUNTING METHOD AND MIXED MOUNTED STRUCTURE
PROBLEM TO BE SOLVED: To provide a mixed mounting method employing a Pb-free solder alloy in which reflow soldering of a low heat resistant electronic component, e.g. an FPGA, is realized while sustaining the reliability of solder joint strength at the time of reflow soldering. SOLUTION: The mixed m...
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| creator | ISHIHARA SHOSAKU NAKATSUKA TETSUYA OMURA TOMOYUKI SUGAWARA SADAYUKI SERIZAWA KOJI SAEKI TOSHIO TAKANO NOBUHIDE |
| description | PROBLEM TO BE SOLVED: To provide a mixed mounting method employing a Pb-free solder alloy in which reflow soldering of a low heat resistant electronic component, e.g. an FPGA, is realized while sustaining the reliability of solder joint strength at the time of reflow soldering. SOLUTION: The mixed mounting method employing a Pb-free solder alloy comprises a step for reflow soldering a surface mounting component 2 at least onto the upper surface of a circuit board 1 using Pb-free reflow solder paste composed of an Sn-(1-4)Ag-(0-1)Cu-(7-10)In (unit: mass%) based alloy, a step for inserting the lead or terminal of an inserted mounting component 5 into a through hole made through the circuit board 1 from the upper surface side, a flux coating step, a preheating step, and a step for reflow soldering the lead or terminal of the inserted mounting component to the circuit board 1 by applying a jet stream 3 of Pb-free solder to the lower surface of the circuit board 1 preheated in the preheating process. COPYRIGHT: (C)2005,JPO&NCIPI |
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SOLUTION: The mixed mounting method employing a Pb-free solder alloy comprises a step for reflow soldering a surface mounting component 2 at least onto the upper surface of a circuit board 1 using Pb-free reflow solder paste composed of an Sn-(1-4)Ag-(0-1)Cu-(7-10)In (unit: mass%) based alloy, a step for inserting the lead or terminal of an inserted mounting component 5 into a through hole made through the circuit board 1 from the upper surface side, a flux coating step, a preheating step, and a step for reflow soldering the lead or terminal of the inserted mounting component to the circuit board 1 by applying a jet stream 3 of Pb-free solder to the lower surface of the circuit board 1 preheated in the preheating process. 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SOLUTION: The mixed mounting method employing a Pb-free solder alloy comprises a step for reflow soldering a surface mounting component 2 at least onto the upper surface of a circuit board 1 using Pb-free reflow solder paste composed of an Sn-(1-4)Ag-(0-1)Cu-(7-10)In (unit: mass%) based alloy, a step for inserting the lead or terminal of an inserted mounting component 5 into a through hole made through the circuit board 1 from the upper surface side, a flux coating step, a preheating step, and a step for reflow soldering the lead or terminal of the inserted mounting component to the circuit board 1 by applying a jet stream 3 of Pb-free solder to the lower surface of the circuit board 1 preheated in the preheating process. 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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | REFLOW SOLDERING METHOD EMPLOYING Pb-FREE SOLDER ALLOY, REFLOW SOLDERING METHOD, MIXED MOUNTING METHOD AND MIXED MOUNTED STRUCTURE |
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