COMPOSITE CIRCUIT BOARD AND ITS MANUFACTURING METHOD

COMPOSITE CIRCUIT BOARD AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a composite circuit board of a low conductive resistance at a low cost which can be reliably joined with a ceramic circuit board and a resin circuit board of high dimensional precision, and causes no electrical disconnection; and to provide a method of manufacturing...

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1. Verfasser: FUKUDA JUNZO
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Sprache:eng
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator FUKUDA JUNZO
description PROBLEM TO BE SOLVED: To provide a composite circuit board of a low conductive resistance at a low cost which can be reliably joined with a ceramic circuit board and a resin circuit board of high dimensional precision, and causes no electrical disconnection; and to provide a method of manufacturing the same. SOLUTION: The composite circuit board 10 has an arrangement wherein junction is made between the ceramic circuit board 11 having a first circuit pattern 14 and first via holes 13, which is suppressed from having burning shrinkage in a planar direction by effecting burning in advance to give burning shrinkage in the thickness direction, and the resin circuit board 12 having a second circuit pattern 17 and second via holes 16 with connector pads 18 being exposed to a surface thereof. The circuit board 10 is provided with metal bumps 15 which are each connected to the first via hole 13 of the ceramic circuit board 11 and/or the first circuit pattern 14 connected to the first via hole 13, and which are each connected to the connector pad 18 for establishing electrical connection between the ceramic circuit board 11 and the resin circuit board 12; and notches 21 provided to the resin circuit board 12, each consisting of a through hole which forms a cavity 20 for enclosing an electronic part 19 therein with the resin circuit board 12. COPYRIGHT: (C)2005,JPO&NCIPI
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SOLUTION: The composite circuit board 10 has an arrangement wherein junction is made between the ceramic circuit board 11 having a first circuit pattern 14 and first via holes 13, which is suppressed from having burning shrinkage in a planar direction by effecting burning in advance to give burning shrinkage in the thickness direction, and the resin circuit board 12 having a second circuit pattern 17 and second via holes 16 with connector pads 18 being exposed to a surface thereof. 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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title COMPOSITE CIRCUIT BOARD AND ITS MANUFACTURING METHOD
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