RELAY SUBSTRATE, RELAY SUBSTRATE WITH SEMICONDUCTOR ELEMENT, SUBSTRATE WITH RELAY SUBSTRATE, AND STRUCTURE COMPOSED OF SEMICONDUCTOR ELEMENT, RELAY SUBSTRATE AND SUBSTRATE
PROBLEM TO BE SOLVED: To provide a structure composed of a semiconductor element, a relay substrate, and a substrate which is relatively easy to manufacture and has an excellent connection reliability. SOLUTION: The structure 11 is composed of the semiconductor element 15, the relay substrate 21, an...
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| creator | IMAI TAKAHARU KASHIMA HISATO |
| description | PROBLEM TO BE SOLVED: To provide a structure composed of a semiconductor element, a relay substrate, and a substrate which is relatively easy to manufacture and has an excellent connection reliability. SOLUTION: The structure 11 is composed of the semiconductor element 15, the relay substrate 21, and the substrate 41. The semiconductor element 15 is mounted on the first face 32 of a main body 38 of the relay substrate, while the second face 33 of the main body 38 of the relay substrate is mounted on the surface of the substrate 41. A plurality of first face-side terminals 28 are arranged on the first face 22 side of the main body 38 of the relay substrate, while a plurality of second face-side terminals 29 are arranged on the second face 23 side. Between the first face-side terminals 28 and the second face-side terminals 29, conductivity paths are established by electric continuity structures 30, 31, 32. A distance 37 between centers of each two adjacent second face-side terminals 29 and 29 is set larger than a distance 36 between centers of each two adjacent first face-side terminals 28 and 28. COPYRIGHT: (C)2005,JPO&NCIPI |
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SOLUTION: The structure 11 is composed of the semiconductor element 15, the relay substrate 21, and the substrate 41. The semiconductor element 15 is mounted on the first face 32 of a main body 38 of the relay substrate, while the second face 33 of the main body 38 of the relay substrate is mounted on the surface of the substrate 41. A plurality of first face-side terminals 28 are arranged on the first face 22 side of the main body 38 of the relay substrate, while a plurality of second face-side terminals 29 are arranged on the second face 23 side. Between the first face-side terminals 28 and the second face-side terminals 29, conductivity paths are established by electric continuity structures 30, 31, 32. A distance 37 between centers of each two adjacent second face-side terminals 29 and 29 is set larger than a distance 36 between centers of each two adjacent first face-side terminals 28 and 28. 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| subjects | BASIC ELECTRIC ELEMENTS CURRENT COLLECTORS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINE CONNECTORS SEMICONDUCTOR DEVICES |
| title | RELAY SUBSTRATE, RELAY SUBSTRATE WITH SEMICONDUCTOR ELEMENT, SUBSTRATE WITH RELAY SUBSTRATE, AND STRUCTURE COMPOSED OF SEMICONDUCTOR ELEMENT, RELAY SUBSTRATE AND SUBSTRATE |
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