ADHESIVE TAPE FOR ELECTRONIC PART

PROBLEM TO BE SOLVED: To solve the following problem: a reflow method is generally used in a process for mounting an IC to a leadframe, the mounted part is elevated to 200-260°C and separation (described as package cracks) is generated at an interface between the leadframe and a molded resin caused...

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Bibliographische Detailangaben
Hauptverfasser:	SEI AKIKUNI, HASHIMOTO TAKESHI, YAMAZAKI HIRONOBU, NAKABA KATSUJI, TOCHIHIRA JIYUN
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To solve the following problem: a reflow method is generally used in a process for mounting an IC to a leadframe, the mounted part is elevated to 200-260°C and separation (described as package cracks) is generated at an interface between the leadframe and a molded resin caused by vaporization of water included in the package by heat. SOLUTION: The adhesive tape for electronic parts is prepared by forming an adhesive layer at least on one surface of a heat resistant film. The amount of a generated outgas when the tape adhered to the surface of the leadframe is heated at 200°C for 1 hour and subsequently at 240°C for 10 minutes is regulated to be ≤ 10% carbon ratio in ≤10 nm depth from the back surface of the leadframe. COPYRIGHT: (C)2005,JPO&NCIPI