RETAINER AND WAFER POLISHING DEVICE
PROBLEM TO BE SOLVED: To provide a retainer which can prevent peripheral sagging generated in a peripheral section of a wafer and has a long lifetime. SOLUTION: When the wafer W is pushed against a rotating polishing pad 11 and the surface of the wafer W is polished, the retainer 23 holds the periph...
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| creator | MASUNAGA TAKAYUKI OBUCHI SHINOBU |
| description | PROBLEM TO BE SOLVED: To provide a retainer which can prevent peripheral sagging generated in a peripheral section of a wafer and has a long lifetime. SOLUTION: When the wafer W is pushed against a rotating polishing pad 11 and the surface of the wafer W is polished, the retainer 23 holds the peripheral section of the wafer W so that the wafer is not detached. There are provided a first ring 23a surrounding the periphery of the wafer W while abutting the pad 11, and a second annular ring 23b being arranged on the outside in the diametral direction of the first ring 23a while abutting the pad 11 and having an abrasion resistance higher than the first ring 23a. COPYRIGHT: (C)2005,JPO&NCIPI |
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SOLUTION: When the wafer W is pushed against a rotating polishing pad 11 and the surface of the wafer W is polished, the retainer 23 holds the peripheral section of the wafer W so that the wafer is not detached. There are provided a first ring 23a surrounding the periphery of the wafer W while abutting the pad 11, and a second annular ring 23b being arranged on the outside in the diametral direction of the first ring 23a while abutting the pad 11 and having an abrasion resistance higher than the first ring 23a. 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SOLUTION: When the wafer W is pushed against a rotating polishing pad 11 and the surface of the wafer W is polished, the retainer 23 holds the peripheral section of the wafer W so that the wafer is not detached. There are provided a first ring 23a surrounding the periphery of the wafer W while abutting the pad 11, and a second annular ring 23b being arranged on the outside in the diametral direction of the first ring 23a while abutting the pad 11 and having an abrasion resistance higher than the first ring 23a. 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SOLUTION: When the wafer W is pushed against a rotating polishing pad 11 and the surface of the wafer W is polished, the retainer 23 holds the peripheral section of the wafer W so that the wafer is not detached. There are provided a first ring 23a surrounding the periphery of the wafer W while abutting the pad 11, and a second annular ring 23b being arranged on the outside in the diametral direction of the first ring 23a while abutting the pad 11 and having an abrasion resistance higher than the first ring 23a. COPYRIGHT: (C)2005,JPO&NCIPI</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING |
| title | RETAINER AND WAFER POLISHING DEVICE |
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