GROUNDING STRUCTURE

PROBLEM TO BE SOLVED: To provide a grounding structure wherein ground patterns on the front and rear surfaces of a substrate are stabilized relative to the high-frequency current by using a simplified structure which is not limited by how the housing is constituted. SOLUTION: The grounding structure...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	HIRAMATSU YOSHIYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CURRENT COLLECTORS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

container_end_page
container_issue
container_start_page
container_title
container_volume
creator	HIRAMATSU YOSHIYUKI
description	PROBLEM TO BE SOLVED: To provide a grounding structure wherein ground patterns on the front and rear surfaces of a substrate are stabilized relative to the high-frequency current by using a simplified structure which is not limited by how the housing is constituted. SOLUTION: The grounding structure for grounding ground patterns 3 on the front and rear surfaces of a multilayer substrate 2 to an electronic component main body 5 has slender ground patterns 3 arranged on the both surfaces of, and along the periphery of, the multilayer substrate 2 and slender ground clips 1 which are conductive. The substrate peripheral sides are pinched in the spring-like U-shape sections of the ground clips 1, so that the U-shape sections cover the substrate peripheral sides and contact the ground patterns 3 on the front and rear surfaces of the substrate 2. As the result, the two ground patterns 3 are connected to each other by the ground clips 1. COPYRIGHT: (C)2005,JPO&NCIPI
format	Patent
fullrecord	<record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2004327665A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2004327665A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2004327665A3</originalsourceid><addsrcrecordid>eNrjZBB2D_IP9XPx9HNXCA4JCnUOCQ1y5WFgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8V4BRgYGJsZG5mZmpo7GRCkCALKRHxI</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>GROUNDING STRUCTURE</title><source>esp@cenet</source><creator>HIRAMATSU YOSHIYUKI</creator><creatorcontrib>HIRAMATSU YOSHIYUKI</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a grounding structure wherein ground patterns on the front and rear surfaces of a substrate are stabilized relative to the high-frequency current by using a simplified structure which is not limited by how the housing is constituted. SOLUTION: The grounding structure for grounding ground patterns 3 on the front and rear surfaces of a multilayer substrate 2 to an electronic component main body 5 has slender ground patterns 3 arranged on the both surfaces of, and along the periphery of, the multilayer substrate 2 and slender ground clips 1 which are conductive. The substrate peripheral sides are pinched in the spring-like U-shape sections of the ground clips 1, so that the U-shape sections cover the substrate peripheral sides and contact the ground patterns 3 on the front and rear surfaces of the substrate 2. As the result, the two ground patterns 3 are connected to each other by the ground clips 1. COPYRIGHT: (C)2005,JPO&NCIPI</description><edition>7</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CURRENT COLLECTORS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; LINE CONNECTORS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2004</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20041118&DB=EPODOC&CC=JP&NR=2004327665A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20041118&DB=EPODOC&CC=JP&NR=2004327665A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HIRAMATSU YOSHIYUKI</creatorcontrib><title>GROUNDING STRUCTURE</title><description>PROBLEM TO BE SOLVED: To provide a grounding structure wherein ground patterns on the front and rear surfaces of a substrate are stabilized relative to the high-frequency current by using a simplified structure which is not limited by how the housing is constituted. SOLUTION: The grounding structure for grounding ground patterns 3 on the front and rear surfaces of a multilayer substrate 2 to an electronic component main body 5 has slender ground patterns 3 arranged on the both surfaces of, and along the periphery of, the multilayer substrate 2 and slender ground clips 1 which are conductive. The substrate peripheral sides are pinched in the spring-like U-shape sections of the ground clips 1, so that the U-shape sections cover the substrate peripheral sides and contact the ground patterns 3 on the front and rear surfaces of the substrate 2. As the result, the two ground patterns 3 are connected to each other by the ground clips 1. COPYRIGHT: (C)2005,JPO&NCIPI</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CURRENT COLLECTORS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>LINE CONNECTORS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2004</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBB2D_IP9XPx9HNXCA4JCnUOCQ1y5WFgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8V4BRgYGJsZG5mZmpo7GRCkCALKRHxI</recordid><startdate>20041118</startdate><enddate>20041118</enddate><creator>HIRAMATSU YOSHIYUKI</creator><scope>EVB</scope></search><sort><creationdate>20041118</creationdate><title>GROUNDING STRUCTURE</title><author>HIRAMATSU YOSHIYUKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2004327665A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2004</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CURRENT COLLECTORS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>LINE CONNECTORS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>HIRAMATSU YOSHIYUKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HIRAMATSU YOSHIYUKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>GROUNDING STRUCTURE</title><date>2004-11-18</date><risdate>2004</risdate><abstract>PROBLEM TO BE SOLVED: To provide a grounding structure wherein ground patterns on the front and rear surfaces of a substrate are stabilized relative to the high-frequency current by using a simplified structure which is not limited by how the housing is constituted. SOLUTION: The grounding structure for grounding ground patterns 3 on the front and rear surfaces of a multilayer substrate 2 to an electronic component main body 5 has slender ground patterns 3 arranged on the both surfaces of, and along the periphery of, the multilayer substrate 2 and slender ground clips 1 which are conductive. The substrate peripheral sides are pinched in the spring-like U-shape sections of the ground clips 1, so that the U-shape sections cover the substrate peripheral sides and contact the ground patterns 3 on the front and rear surfaces of the substrate 2. As the result, the two ground patterns 3 are connected to each other by the ground clips 1. COPYRIGHT: (C)2005,JPO&NCIPI</abstract><edition>7</edition><oa>free_for_read</oa></addata></record>
fulltext	fulltext_linktorsrc
identifier
ispartof
issn
language	eng
recordid	cdi_epo_espacenet_JP2004327665A
source	esp@cenet
subjects	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CURRENT COLLECTORS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
title	GROUNDING STRUCTURE
url	https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-01T15%3A50%3A28IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=HIRAMATSU%20YOSHIYUKI&rft.date=2004-11-18&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2004327665A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true