LEAD FRAME SUBSTRATE
PROBLEM TO BE SOLVED: To provide a lead frame substrate wherein a mount component is not affected by heat and solder cracks are not generated in soldering by inserting a lead of the mount component to a hole of a conductor metal which is subjected to burring processing. SOLUTION: In the lead frame 1...
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| creator | SUZUKI ITSUO MIURA TAKESHI MORITA MASATO |
| description | PROBLEM TO BE SOLVED: To provide a lead frame substrate wherein a mount component is not affected by heat and solder cracks are not generated in soldering by inserting a lead of the mount component to a hole of a conductor metal which is subjected to burring processing. SOLUTION: In the lead frame 1 wherein the surface of a conductor metal 2 is coated with a non-conductor of a resin 3 and the resin 3 is removed only in a part whereto a lead 7 of the mount component 6 to be packaged is soldered, a burr 5 is formed in an opposite side of a packaging side of the mount component 6 by shaping a hole 4 for inserting the lead 7 by carrying out burring for a removal part of the resin 3. The lead 7 is inserted to the hole 4 and the burr 5, and soldering is carried out to envelop the lead 7, the hole 4 and the burr 5. COPYRIGHT: (C)2005,JPO&NCIPI |
| format | Patent |
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SOLUTION: In the lead frame 1 wherein the surface of a conductor metal 2 is coated with a non-conductor of a resin 3 and the resin 3 is removed only in a part whereto a lead 7 of the mount component 6 to be packaged is soldered, a burr 5 is formed in an opposite side of a packaging side of the mount component 6 by shaping a hole 4 for inserting the lead 7 by carrying out burring for a removal part of the resin 3. The lead 7 is inserted to the hole 4 and the burr 5, and soldering is carried out to envelop the lead 7, the hole 4 and the burr 5. 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SOLUTION: In the lead frame 1 wherein the surface of a conductor metal 2 is coated with a non-conductor of a resin 3 and the resin 3 is removed only in a part whereto a lead 7 of the mount component 6 to be packaged is soldered, a burr 5 is formed in an opposite side of a packaging side of the mount component 6 by shaping a hole 4 for inserting the lead 7 by carrying out burring for a removal part of the resin 3. The lead 7 is inserted to the hole 4 and the burr 5, and soldering is carried out to envelop the lead 7, the hole 4 and the burr 5. 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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | LEAD FRAME SUBSTRATE |
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