HEAT CONDUCTION STRUCTURE OF ELECTRONIC EQUIPMENT
PROBLEM TO BE SOLVED: To obtain a heat conduction structure of electronic equipment in which generated heat from electrical parts can be conducted to a substrate frame or a cover member while the breakdown of the electrical parts and the breakdown of a heat conduction system by vibrations can be pre...
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| creator | NAKAGAWA NOBUO |
| description | PROBLEM TO BE SOLVED: To obtain a heat conduction structure of electronic equipment in which generated heat from electrical parts can be conducted to a substrate frame or a cover member while the breakdown of the electrical parts and the breakdown of a heat conduction system by vibrations can be prevented, and which has excellent heat-conduction performance and vibration-resistant performance. SOLUTION: The heat conduction structure of the electronic equipment has the substrate frame 1 in which a substrate 2 with the electrical part 3 mounted thereon is housed and which is sealed hermetically by the cover member 4 and prevents an external effect on the substrate 2, and a heat conduction member conducting the heat generation of the part 3 to the frame 1 or the member 2. The heat conduction structure has a first heat conduction plate 6 mounted on the part 3 through a silicon material 5, a vibration absorption member 7 composed of a heat-conductive flexible member connected to the plate 6, and a second heat conduction plate 8 connected to the member 7 and connected to the frame 1 or the member 4. COPYRIGHT: (C)2005,JPO&NCIPI |
| format | Patent |
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SOLUTION: The heat conduction structure of the electronic equipment has the substrate frame 1 in which a substrate 2 with the electrical part 3 mounted thereon is housed and which is sealed hermetically by the cover member 4 and prevents an external effect on the substrate 2, and a heat conduction member conducting the heat generation of the part 3 to the frame 1 or the member 2. The heat conduction structure has a first heat conduction plate 6 mounted on the part 3 through a silicon material 5, a vibration absorption member 7 composed of a heat-conductive flexible member connected to the plate 6, and a second heat conduction plate 8 connected to the member 7 and connected to the frame 1 or the member 4. 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SOLUTION: The heat conduction structure of the electronic equipment has the substrate frame 1 in which a substrate 2 with the electrical part 3 mounted thereon is housed and which is sealed hermetically by the cover member 4 and prevents an external effect on the substrate 2, and a heat conduction member conducting the heat generation of the part 3 to the frame 1 or the member 2. The heat conduction structure has a first heat conduction plate 6 mounted on the part 3 through a silicon material 5, a vibration absorption member 7 composed of a heat-conductive flexible member connected to the plate 6, and a second heat conduction plate 8 connected to the member 7 and connected to the frame 1 or the member 4. 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SOLUTION: The heat conduction structure of the electronic equipment has the substrate frame 1 in which a substrate 2 with the electrical part 3 mounted thereon is housed and which is sealed hermetically by the cover member 4 and prevents an external effect on the substrate 2, and a heat conduction member conducting the heat generation of the part 3 to the frame 1 or the member 2. The heat conduction structure has a first heat conduction plate 6 mounted on the part 3 through a silicon material 5, a vibration absorption member 7 composed of a heat-conductive flexible member connected to the plate 6, and a second heat conduction plate 8 connected to the member 7 and connected to the frame 1 or the member 4. COPYRIGHT: (C)2005,JPO&NCIPI</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | HEAT CONDUCTION STRUCTURE OF ELECTRONIC EQUIPMENT |
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