ELECTROCONDUCTIVE ADHESIVE

PROBLEM TO BE SOLVED: To provide an electroconductive adhesive which excels in reworkableness without requiring a lot of time and cost, can inhibit migration of an electroconductive metal, can improve adhesiveness properly balanced, and furthermore does not damage a printed board. SOLUTION: The elec...

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Bibliographische Detailangaben
1. Verfasser:	YANAI MASAHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CONDUCTORS DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSULATORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an electroconductive adhesive which excels in reworkableness without requiring a lot of time and cost, can inhibit migration of an electroconductive metal, can improve adhesiveness properly balanced, and furthermore does not damage a printed board. SOLUTION: The electroconductive adhesive comprises at least a thermoplastic resin, a thermosetting compound, and an electroconductive filler, and the thermosetting compound contains at least a compound having a divalent sulfur atom. COPYRIGHT: (C)2005,JPO&NCIPI