ELECTRONIC CONTROLLER

ELECTRONIC CONTROLLER

PROBLEM TO BE SOLVED: To provide an electronic controller where a power element is mounted on a ceramic substrate, and the ceramic substrate is adhered to an aluminum plate being a heat sink by solving the problem that the heat radiation of the power element is deteriorated when the power element on...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: TSURUMAKI KIYOSHI, SUGAWARA HAYATO
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator TSURUMAKI KIYOSHI
SUGAWARA HAYATO
description PROBLEM TO BE SOLVED: To provide an electronic controller where a power element is mounted on a ceramic substrate, and the ceramic substrate is adhered to an aluminum plate being a heat sink by solving the problem that the heat radiation of the power element is deteriorated when the power element on the ceramic substrate is arranged at a position pertinent to the recess of a groove for escaping adhesive formed on the aluminum plate. SOLUTION: An aluminum plate is formed with a groove so that a power element on a ceramic substrate can be positioned at the projecting part of the groove for escaping adhesive. Thus, it is possible to reduce a thermal resistance when the heat generation of the power element is transmitted to the aluminum plate playing the role of a heat sink, and to suppress the increase of the temperature of the power element. COPYRIGHT: (C)2004,JPO&NCIPI
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2004273871A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2004273871A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2004273871A3</originalsourceid><addsrcrecordid>eNrjZBB19XF1Dgny9_N0VnD29wOyfHxcg3gYWNMSc4pTeaE0N4OSm2uIs4duakF-fGpxQWJyal5qSbxXgJGBgYmRubGFuaGjMVGKAOQqH4A</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>ELECTRONIC CONTROLLER</title><source>esp@cenet</source><creator>TSURUMAKI KIYOSHI ; SUGAWARA HAYATO</creator><creatorcontrib>TSURUMAKI KIYOSHI ; SUGAWARA HAYATO</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide an electronic controller where a power element is mounted on a ceramic substrate, and the ceramic substrate is adhered to an aluminum plate being a heat sink by solving the problem that the heat radiation of the power element is deteriorated when the power element on the ceramic substrate is arranged at a position pertinent to the recess of a groove for escaping adhesive formed on the aluminum plate. SOLUTION: An aluminum plate is formed with a groove so that a power element on a ceramic substrate can be positioned at the projecting part of the groove for escaping adhesive. Thus, it is possible to reduce a thermal resistance when the heat generation of the power element is transmitted to the aluminum plate playing the role of a heat sink, and to suppress the increase of the temperature of the power element. COPYRIGHT: (C)2004,JPO&amp;NCIPI</description><edition>7</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2004</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20040930&amp;DB=EPODOC&amp;CC=JP&amp;NR=2004273871A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20040930&amp;DB=EPODOC&amp;CC=JP&amp;NR=2004273871A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TSURUMAKI KIYOSHI</creatorcontrib><creatorcontrib>SUGAWARA HAYATO</creatorcontrib><title>ELECTRONIC CONTROLLER</title><description>PROBLEM TO BE SOLVED: To provide an electronic controller where a power element is mounted on a ceramic substrate, and the ceramic substrate is adhered to an aluminum plate being a heat sink by solving the problem that the heat radiation of the power element is deteriorated when the power element on the ceramic substrate is arranged at a position pertinent to the recess of a groove for escaping adhesive formed on the aluminum plate. SOLUTION: An aluminum plate is formed with a groove so that a power element on a ceramic substrate can be positioned at the projecting part of the groove for escaping adhesive. Thus, it is possible to reduce a thermal resistance when the heat generation of the power element is transmitted to the aluminum plate playing the role of a heat sink, and to suppress the increase of the temperature of the power element. COPYRIGHT: (C)2004,JPO&amp;NCIPI</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2004</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBB19XF1Dgny9_N0VnD29wOyfHxcg3gYWNMSc4pTeaE0N4OSm2uIs4duakF-fGpxQWJyal5qSbxXgJGBgYmRubGFuaGjMVGKAOQqH4A</recordid><startdate>20040930</startdate><enddate>20040930</enddate><creator>TSURUMAKI KIYOSHI</creator><creator>SUGAWARA HAYATO</creator><scope>EVB</scope></search><sort><creationdate>20040930</creationdate><title>ELECTRONIC CONTROLLER</title><author>TSURUMAKI KIYOSHI ; SUGAWARA HAYATO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2004273871A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2004</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>TSURUMAKI KIYOSHI</creatorcontrib><creatorcontrib>SUGAWARA HAYATO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TSURUMAKI KIYOSHI</au><au>SUGAWARA HAYATO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ELECTRONIC CONTROLLER</title><date>2004-09-30</date><risdate>2004</risdate><abstract>PROBLEM TO BE SOLVED: To provide an electronic controller where a power element is mounted on a ceramic substrate, and the ceramic substrate is adhered to an aluminum plate being a heat sink by solving the problem that the heat radiation of the power element is deteriorated when the power element on the ceramic substrate is arranged at a position pertinent to the recess of a groove for escaping adhesive formed on the aluminum plate. SOLUTION: An aluminum plate is formed with a groove so that a power element on a ceramic substrate can be positioned at the projecting part of the groove for escaping adhesive. Thus, it is possible to reduce a thermal resistance when the heat generation of the power element is transmitted to the aluminum plate playing the role of a heat sink, and to suppress the increase of the temperature of the power element. COPYRIGHT: (C)2004,JPO&amp;NCIPI</abstract><edition>7</edition><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_JP2004273871A
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title ELECTRONIC CONTROLLER
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-02T09%3A00%3A45IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=TSURUMAKI%20KIYOSHI&rft.date=2004-09-30&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2004273871A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true